SCES905F July   2019  – January 2024 SN74AXC4T245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7V ± 0.05V
    7. 5.7  Switching Characteristics, VCCA = 0.8V ± 0.04V
    8. 5.8  Switching Characteristics, VCCA = 0.9V ± 0.045V
    9. 5.9  Switching Characteristics, VCCA = 1.2V ± 0.1V
    10. 5.10 Switching Characteristics, VCCA = 1.5V ± 0.1V
    11. 5.11 Switching Characteristics, VCCA = 1.8V ± 0.15V
    12. 5.12 Switching Characteristics, VCCA = 2.5V ± 0.2V
    13. 5.13 Switching Characteristics, VCCA = 3.3V ± 0.3V
    14. 5.14 Operating Characteristics: TA = 25°C
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Standard CMOS Inputs
      2. 7.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3  Partial Power Down (Ioff)
      4. 7.3.4  VCC Isolation
      5. 7.3.5  Over-Voltage Tolerant Inputs
      6. 7.3.6  Glitch-Free Power Supply Sequencing
      7. 7.3.7  Negative Clamping Diodes
      8. 7.3.8  Fully Configurable Dual-Rail Design
      9. 7.3.9  I/Os with Integrated Static Pull-Down Resistors
      10. 7.3.10 Supports High-Speed Translation
      11. 7.3.11 Wettable Flanks
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Application Information

The AEC-Q100 qualified SN74AXC4T245-Q1 device can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. The SN74AXC4T245-Q1 device is ideal for use in applications where a push-pull driver is connected to the data I/Os. The maximum data rate can be up to 380 Mbps when device translates a signal from 1.8V to 3.3V.

Figure 8-1 shows an example application where the SN74AXC4T245-Q1 device is used to translate a low voltage UART signal from an SoC to a higher voltage signal which properly drives the inputs of the Bluetooth® module, and vice versa.