SCDS019M May   1995  – December 2015 SN74CBT3251

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristic
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • DBQ|16
  • RGY|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

The SN74CBT351 device can be used for a wide variety of applications, including expanding MCU GPIOs.

9.2 Typical Application

One application of the SN74CBT3251 device is to use in conjunction with a microcontroller to poll a keypad. Figure 4 shows the basic schematic for such a polling system. The microcontroller uses the channel-select pins to cycle through the different channels while reading the input to see if a user is pressing any of the keys. This is a very robust setup that allows for simultaneous key presses with very little power consumption. It also uses very few pins on the microcontroller. The down side of polling is that the microcontroller must frequently scan the keys for a press.

SN74CBT3251 SCDS019-TypApplication.gif Figure 4. Keypad Polling Application

9.2.1 Design Requirements

These devices use CMOS technology and have balanced output drive. Take care to avoid bus contention because it can drive currents that would exceed maximum limits.

9.2.2 Detailed Design Procedure

  1. Recommended input conditions:
    • For switch time specifications, see propagation delay times in .
    • Inputs must not be pulled below ground.
    • For input voltage level specifications for control inputs, see VIH and VIL in .
  2. Input and output current consideration:
    • Load currents must not exceed per output and must not exceed (Continuous current through VCC or GND) total current for the part. These limits are located in .

9.2.3 Application Curve

SN74CBT3251 C001_SCES207.png Figure 5. rON Over Temperature