SN74CBT3251

ACTIVE

5-V, 8:1 1-channel general-purpose FET bus switch

Top

Product details

Parameters

Configuration 8:1 Number of channels (#) 1 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 128 Rating Catalog open-in-new Find other Analog switches/muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DB) 16 48 mm² 6.2 x 7.8 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches/muxes

Features

  • 5-Ω Switch Connection Between Two Ports
  • TTL-Compatible Input Levels
  • Low Crosstalk Between Switches
  • Fast Switching and Propagation Speeds
  • Operating Temperature Range: –40°C to 85°C

All trademarks are the property of their respective owners.

open-in-new Find other Analog switches/muxes

Description

The SN74CBT3251 is a 1-of-8 high-speed TTL-compatible FET multiplexer and demultiplexer. The low ON-state resistance of the switch allows connections to be made with minimal propagation delay.

When output enable (OE) is low, the SN74CBT3251 is enabled, and S0, S1, and S2 select one of the B outputs for the A-input data.

open-in-new Find other Analog switches/muxes
Download
Similar products you might be interested in
open-in-new Compare products
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
NEW TMUX1308 PREVIEW 1-channel, 8:1 general-purpose analog multiplexer with 1.8-V logic control Upgraded 1.8-V logic support and smaller package options

Technical documentation

= Featured
No results found. Please clear your search and try again. View all 30
Type Title Date
* Datasheet SN74CBT3251 1-of-8 FET Multiplexer and Demultiplexer datasheet (Rev. M) Dec. 29, 2015
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes How to Select Little Logic (Rev. A) Jul. 26, 2016
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application notes VOLTAGE LEVEL TRANSLATION (SL) - Family Sep. 21, 2011
Solution guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature CBT RAID Application Clip Jun. 12, 2003
Application notes Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application notes Texas Instruments Little Logic Application Report Nov. 01, 2002
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application notes 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application notes Flexible Voltage-Level Translation With CBT Family Devices Jul. 20, 1999
User guides CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) Dec. 01, 1998
Application notes 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A) Apr. 03, 1998
Application notes Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application notes 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B) Mar. 01, 1997
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDM032.ZIP (27 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DB) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​