SCLS785F December   2019  – December 2021 SN74HCS595-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9.     15
    10. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1 Balanced CMOS 3-State Outputs
      2. 8.2.2 Balanced CMOS Push-Pull Outputs
      3. 8.2.3 Latching Logic
      4. 8.2.4 Clamp Diode Structure
      5. 8.2.5 Wettable Flanks
    3. 8.3 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (September 2021) to Revision F (December 2021)

  • Changed the status of the WBQB package from Product Preview to Production Go

Changes from Revision D (June 2021) to Revision E (September 2021)

  • Added features for WBQB packageGo
  • Added WBQB part number to device information tableGo
  • Added WBQB package to WQFN pinout diagram and to pin functions tableGo
  • Added WBQB package to Thermal Information table Go

Changes from Revision C (March 2021) to Revision D (June 2021)

  • Changed DYY package from Product Preview to Production Data Go

Changes from Revision B (August 2020) to Revision C (March 2021)

  • Added DYY Package to Device Information TableGo
  • Added DYY Package pinout diagram and information to Pin Configuration and Functions.Go
  • Added DYY Package to Thermal Information tableGo

Changes from Revision A (February 2020) to Revision B (August 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the document.Go
  • Added BQB package to orderable tableGo
  • Added BQB Package to Thermal Information tableGo

Changes from Revision * (December 2019) to Revision A (February 2020)

  • Changed from Application Information to Production DataGo
  • Added D package to orderable tableGo
  • Added D Package to Thermal Information tableGo