SCES629B may   2005  – july 2023 SN74LV125AT

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Revision History
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Operating Characteristics
  7. 6Parameter Measurement Information
  8. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN74LV125ATUNIT
MINMAX
VCCSupply voltage4.55.5V
VIH High-level input voltageVCC = 4.5 V to 5.5 V2 V
VIL Low-level input voltageVCC = 4.5 V to 5.5 V0.8 V
VIInput voltage05.5V
VOOutput voltageHigh or low state0VCCV
3-state05.5
IOH High-level output currentVCC = 4.5 V to 5.5 V–16 mA
IOL Low-level output currentVCC = 4.5 V to 5.5 V16 mA
∆t/∆v Input transition rise or fall rateVCC = 4.5 V to 5.5 V20 ns/V
TAOperating free-air temperature–40125°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).