SCLS990 November 2023 SN74LV8T165
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | BQB (WQFN) | PW (TSSOP) | UNIT | |
---|---|---|---|---|
16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 105.6 | 131.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 96.6 | 69.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 75.4 | 75.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 19.1 | 21 | °C/W |
YJB | Junction-to-board characterization parameter | 75.4 | 75.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 56.1 | N/A | °C/W |