SCES308L August   2001  – May 2015 SN74LVC2G07

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Switching Characteristics from -40°C to 125°C
    5. 6.5 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 (Open-Drain)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Dual Open-Drain Buffer Configuration
  • -24-mA Output Drive at 3.3 V
  • Support Translation-Up and Down
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs and Open-Drain Outputs Accept Voltages Up to 5.5 V
  • Max tpd of 3.7 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

2 Applications

  • Blu-ray Players and Home Theaters
  • DVD Recorders and Players
  • Desktops or Notebook PCs
  • Digital Video Cameras (DVC)
  • Embedded PCs
  • GPS: Personal Navigation Devices
  • Mobile Phones
  • Network Projector Front Ends
  • Portable Media Players
  • Solid State Drive (SSD): Enterprise
  • High-Definition (HDTV)
  • Tablet: Enterprise
  • Audio Dock: Portable
  • DLP Front Projection System

3 Description

This dual buffer and driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree package technology is a major
breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC2G07 SOT-23 (6) 2.90 mm × 1.60 mm
SC70 (6) 2.00 mm × 1.25 mm
DRY SON (6) 1.45 mm × 1.00 mm
DSF SON (6) 1.00 mm × 1.00 mm
DSBGA (6) 1.41 mm × 0.91 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Functional Block Diagram

SN74LVC2G07 ld_ces308.gif

4 Revision History

Changes from K Revision (November 2013) to L Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from J Revision (August 2012) to K Revision

  • Updated document to new TI data sheet format.Go
  • Updated operating temperature range.Go