SCAS757B December   2003  – September 2014 SN74LVCH16374A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VI Input voltage range(2) –0.5 6.5 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VO Voltage range applied to any output in the high or low state(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage Operating 1.65 3.6 V
Data retention only 1.5
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 2.7 V to 3.6 V 2
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 2.7 V to 3.6 V 0.8
VI Input voltage 0 5.5 V
VO Output voltage High or low state 0 VCC V
High-impedance state 0 5.5
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 2.7 V –12
VCC = 3 V –24
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 2.7 V 12
VCC = 3 V 24
Δt/Δv Input transition rise or fall rate 10 ns/V
TA Operating free-air temperature –40 125 °C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC(1) SN74LVCH16374A UNIT
DL DGG DGV
48 PINS
RθJA Junction-to-ambient thermal resistance 68.4 64.3 78.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 34.7 17.6 30.7
RθJB Junction-to-board thermal resistance 41.0 31.5 41.8
ψJT Junction-to-top characterization parameter 12.3 1.1 3.8
ψJB Junction-to-board characterization parameter 40.4 31.2 41.3
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN  TYP(1) MAX UNIT
VOH IOH = –100 μA 1.65 V to 3.6 V VCC – 0.2  V
IOH = –4 mA 1.65 V 1.2 
IOH = –8 mA 2.3 V 1.7 
IOH = –12 mA 2.7 V 2.2 
3 V 2.4 
IOH = –24 mA 3 V 2.2 
VOL IOL = 100 μA 1.65 V to 3.6 V 0.2 V
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.7
IOL = 12 mA 2.7 V 0.4
IOL = 24 mA 3 V 0.55
II VI = 0 to 5.5 V 3.6 V ±5 μA
II(hold) VI = 0.58 V 1.65 V See(2)  μA
VI = 1.07 V See(2) 
VI = 0.7 V 2.3 V 45 
VI = 1.7 V –45 
VI = 0.8 V 3 V 75 
VI = 2 V –75 
VI = 0 to 3.6 V(3) 3.6 V ±500
Ioff VI or VO = 5.5 V 0 ±10 μA
IOZ VO = 0 to 5.5 V 3.6 V ±10 μA
ICC VI = VCC or GND IO = 0 3.6 V 20 μA
3.6 V ≤ VI ≤ 5.5 V(4) 20
ΔICC One input at VCC – 0.6 V,
Other inputs at VCC or GND		 2.7 V to 3.6 V 500 μA
Ci VI = VCC or GND 3.3 V 5 pF
Co VO = VCC or GND 3.3 V 6.5 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This information was not available at the time of publication.
(3) This is the bus-hold maximum dynamic current required to switch the input from one state to another.
(4) This applies in the disabled state only.

6.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V
± 0.3 V		 UNIT
MIN MAX  MIN MAX MIN MAX MIN MAX
fclock Clock frequency 150 150 150 150 MHz
tw Pulse duration, CLK high or low 3.3   3.3 3.3 3.3 ns
tsu Setup time, data before CLK↑ 2.4   1.6 1.9 1.9 ns
th Hold time, data after CLK↑ 0.8   1 1.1 1.1 ns

6.7 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V
± 0.3 V		 UNIT
MIN  MAX MIN MAX MIN MAX MIN MAX
fmax 150 150 150 150 MHz
tpd CLK Q 1 6.5 1 4.3 1 4.9 1.5 4.5 ns
ten OE Q 1 6.7 1 4.7 1 5.3 1.5 4.6 ns
tdis OE Q 1 10.7 1 5 1 6.1 1.5 5.5 ns
tsk(o) 1 1 1 1 ns

6.8 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V UNIT
TYP  TYP TYP
Cpd Power dissipation capacitance
per flip-flop		 Outputs enabled f = 10 MHz 47 52 58 pF
Outputs disabled 21 23 24

6.9 Typical Characteristics

D001_SCAS757.gifFigure 1. TPD vs Temperature CLK to Q
D002_SCAS757.gifFigure 2. TPD vs VCC CLK to Q