SLLS159G March   1993  – February 2024 SN65C1167 , SN65C1168 , SN75C1167 , SN75C1168

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics, Driver Section
    6. 5.6 Switching Characteristics
    7. 5.7 Electrical Characteristics, Receiver Section
    8. 5.8 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
      1. 7.2.1 Functions Table
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • NS|16
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)DB (SSOP)N (PDIP)NS (SOP)PW (TSSOP)UNIT
16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance

102.6

60.6

88.5

107.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance

48.7

48.1

46.2

38.4

°C/W
RθJBJunction-to-board thermal resistance

54.3

40.6

50.7

53.7

°C/W
ψJTJunction-to-top characterization parameter

11.8

27.5

13.5

3.2

°C/W
ψJBJunction-to-board characterization parameter

53.5

40.3

50.3

53.1

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.