SNLS692B December   2021  – December 2023 SN75LVPE5421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 DC Electrical Characteristics
    6. 5.6 High Speed Electrical Characteristics
    7. 5.7 SMBUS/I2C Timing Characteristics
    8. 5.8 Typical Characteristics
    9. 5.9 Typical Jitter Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Five-Level Control Inputs
      2. 6.3.2 Linear Equalization
      3. 6.3.3 Flat Gain
      4. 6.3.4 Receiver Detect State Machine
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active PCIe Mode
      2. 6.4.2 Active Buffer Mode
      3. 6.4.3 Standby Mode
    5. 6.5 Programming
      1. 6.5.1 Pin Mode
      2. 6.5.2 SMBUS/I2C Register Control Interface
        1. 6.5.2.1 Shared Registers
        2. 6.5.2.2 Channel Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 PCIe x8 Lane Switching
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 Protocol Agnostic Linear Redriver for High Speed Interfaces
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUA|42
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage, VCC to GND DC plus AC power should not exceed these limits 3.0 3.3 3.6 V
NVCC Supply noise tolerance DC to <50 Hz, sinusoidal1 250 mVpp
50 Hz to 500 kHz, sinusoidal1 100 mVpp
500 kHz to 2.5MHz, sinusoidal1 33 mVpp
Supply noise, >2.5MHz, sinusoidal1 10 mVpp
TRampVCC VCC supply ramp time From 0V to 3.0V 0.150 100 ms
TJ Operating junction temperature –40 115 °C
TA Operating ambient temperature –40 85 °C
PWLVCMOS Minimum pulse width required for the device to detect a valid signal on LVCMOS inputs PD and SEL 200 μs
VCCSMBUS SMBus/I2C SDA and SCL open drain termination voltage Supply voltage for open drain pull-up resistor 3.6 V
FSMBus SMBus/I2C clock (SCL) frequency in SMBus secondary mode 10 400 kHz
VIDLAUNCH Source differential launch amplitude 800 1200 mVpp
DR Data rate 1 32 Gbps