SLASF37A January   2024  – January 2025 TAA5412-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configuration
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Microphone Bias
      6. 6.3.6  Digital PDM Microphone Record Channel
      7. 6.3.7  Signal-Chain Processing
        1. 6.3.7.1 ADC Signal-Chain
          1. 6.3.7.1.1  6 to 4 Input Select Multiplexer (6:4 MUX)
          2. 6.3.7.1.2  Programmable Channel Gain and Digital Volume Control
          3. 6.3.7.1.3  Programmable Channel Gain Calibration
          4. 6.3.7.1.4  Programmable Channel Phase Calibration
          5. 6.3.7.1.5  Programmable Digital High-Pass Filter
          6. 6.3.7.1.6  Programmable Digital Biquad Filters
          7. 6.3.7.1.7  Programmable Channel Summer and Digital Mixer
          8. 6.3.7.1.8  Configurable Digital Decimation Filters
            1. 6.3.7.1.8.1 Linear-phase filters
              1. 6.3.7.1.8.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.1.8.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.1.8.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.1.8.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.1.8.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.1.8.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.1.8.1.7 Sampling Rate: 192kHz or 176.4kHz
              8. 6.3.7.1.8.1.8 Sampling Rate: 384kHz or 352.8kHz
              9. 6.3.7.1.8.1.9 Sampling Rate: 768kHz or 705.6kHz
            2. 6.3.7.1.8.2 Low-latency Filters
              1. 6.3.7.1.8.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.8.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.8.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.8.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.8.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.7.1.8.3 Ultra-Low-Latency Filters
              1. 6.3.7.1.8.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.8.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.8.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.8.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.8.3.5 Sampling Rate: 192kHz or 176.4kHz
          9. 6.3.7.1.9  Automatic Gain Controller (AGC)
          10. 6.3.7.1.10 Voice Activity Detection (VAD)
          11. 6.3.7.1.11 Ultrasonic Activity Detection (UAD)
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Input DC Fault Diagnostics
      10. 6.3.10 Power Tune Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Software Reset
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAA5412-Q1_B0_P0 Registers
      2. 7.1.2 TAA5412-Q1_B0_P1 Registers
      3. 7.1.3 TAA5412-Q1_B0_P3 Registers
    2. 7.2 Programmable Coefficient Registers
      1. 7.2.1 Programmable Coefficient Registers: Page 8
      2. 7.2.2 Programmable Coefficient Registers: Page 9
      3. 7.2.3 Programmable Coefficient Registers: Page 10
      4. 7.2.4 Programmable Coefficient Registers: Page 11
      5. 7.2.5 Programmable Coefficient Registers: Page 19
      6. 7.2.6 Programmable Coefficient Registers: Page 27
      7. 7.2.7 Programmable Coefficient Registers: Page 28
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Revision History
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The TAA5412-Q1 is from a scalable TAx5xxx-Q1 family of audio converter devices. As part of the extended family of devices, the TAA5412-Q1 consists of a high-performance, low-power, flexible, multi-channel, audio analog-to-digital converter (ADC) with extensive feature integration. This device is intended for automotive applications such as vehicle cabin active noise cancellation, hands-free in-vehicle communication, emergency call, and multimedia applications. The high dynamic range of this device enables far-field audio recording with high fidelity. This device integrates a host of features that reduce cost, board space, and power consumption in space-constrained automotive sub-system designs. Package, performance, and device-compatible configuration registers make this device well suited for scalable system designs.

The TAA5412-Q1 consists of the following blocks:

  • 2-channel, multibit, high-performance delta-sigma (ΔΣ) ADCs
  • Configurable single-ended or differential audio inputs with high voltage signal swing
  • High-voltage, low-noise programmable microphone bias output
  • Over current diagnostics and protection for MICBIAS
  • Highly flexible, comprehensive input fault diagnostic
  • Automatic gain controller (AGC)
  • Programmable decimation filters with linear-phase, low-latency or ultra low-latency options
  • Programmable channel gain, volume control, and biquad filters for each channel
  • Programmable phase and gain calibration with fine resolution for each channel
  • Programmable high-pass filter (HPF) with programmable cut-off frequency and digital channel mixer
  • Up to 4-channel pulse density modulation (PDM) digital microphone interface with high-performance decimation filter
  • Integrated low-jitter, phase-locked loop (PLL) supporting a wide range of system clocks
  • Integrated digital and analog voltage regulators to support single-supply operation
  • Dual I2S or LJ or TDM interface with independent sample rates (synchronous)
  • Synchronous sample rate converter (SRC)

Communication to the TAA5412-Q1 for configuring the control registers is supported using an I2C or SPI interface. The device supports a highly flexible audio serial interface [time-division multiplexing (TDM), I2S, or left-justified (LJ)] to transmit audio data seamlessly in the system across devices.

The device can support multiple devices by sharing the common I2C and TDM buses across devices. Moreover, the device includes a daisy-chain feature and a secondary audio serial output data pin. These features relax the shared TDM bus timing requirements and board design complexities when operating multiple devices for applications requiring high audio data bandwidth.

Table 6-1 lists the reference abbreviations used throughout this document to registers that control the device.

Table 6-1 Abbreviations for Register References
REFERENCEABBREVIATIONDESCRIPTIONEXAMPLE
Page y, register z, bit kPy_Rz_D[k]Single data bit. The value of a single bit in a register.Page 1, register 36, bit 0 = P1_R36_D[0]
Page y, register z, bits k-mPy_Rz_D[k:m]Range of data bits. A range of data bits (inclusive).Page 1, register 36, bits 3, 2, 1, 0 = P1_R36_D[3:0]
Page y, register zPy_RzOne entire register. All eight bits in the register as a unit.Page 1, register 36 = P1_R36
Page y, registers z-nPy_Rz-RnRange of registers. A range of registers in the same page.Page 1, registers 36, 37, 38 = P1_R36-R38