SLAS778D February   2013  – January 2025 TAS2505

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  I2S/LJF/RJF Timing in Master Mode
    7. 5.7  I2S/LJF/RJF Timing in Slave Mode
    8. 5.8  DSP Timing in Master Mode
    9. 5.9  DSP Timing in Slave Mode
    10. 5.10 I2C Interface Timing
    11. 5.11 SPI Interface Timing
    12. 5.12 Typical Characteristics
      1. 5.12.1 Class D Speaker Driver Performance
      2. 5.12.2 HP Driver Performance
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Audio Analog I/O
      2. 7.3.2 Audio DAC and Audio Analog Outputs
      3. 7.3.3 DAC
      4. 7.3.4 POR
      5. 7.3.5 CLOCK Generation and PLL
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Pins
      2. 7.4.2 Analog Pins
      3. 7.4.3 Multifunction Pins
      4. 7.4.4 Analog Signals
        1. 7.4.4.1 Analog Inputs AINL and AINR
      5. 7.4.5 DAC Processing Blocks — Overview
      6. 7.4.6 Digital Mixing and Routing
      7. 7.4.7 Analog Audio Routing
      8. 7.4.8 Digital Audio and Control Interface
        1. 7.4.8.1 Digital Audio Interface
        2. 7.4.8.2 Control Interface
          1. 7.4.8.2.1 I2C Control Mode
          2. 7.4.8.2.2 SPI Digital Interface
        3. 7.4.8.3 Device Special Functions
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
    8. 10.8 Community Resources
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision C (September 2021) to Revision D (January 2025)

  • Errata in RevC datasheet with the LDO_SEL feature fixed.Go

Changes from Revision B (November 2016) to Revision C (September 2021)

  • Removed all references to LDO mode and LDO_SEL pin throughout data sheet Go

Changes from Revision A (February 2013) to Revision B (November 2016)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

Changes from Revision * (February 2013) to Revision A (February 2013)

  • Deleted PO (Max Output power) SPKVDD = 5.5 V, THD = 10%Go
  • Changed PO (Max Output power) SPKVDD = 5.5 V value From: TYP = 2.1 W To: MAX = 2 WGo