SLOSE88A December   2024  – March 2025 TAS6754-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 ESD Ratings
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply
        1. 7.3.1.1 Power-Supply Sequence
          1. 7.3.1.1.1 Power-Up Sequence
          2. 7.3.1.1.2 Power-Down Sequence
        2. 7.3.1.2 Device Initialization and Power-On-Reset (POR)
      2. 7.3.2 Serial Audio Port
        1. 7.3.2.1 Left-Justified Timing
        2. 7.3.2.2 I2S Mode
        3. 7.3.2.3 DSP Mode
        4. 7.3.2.4 TDM Mode
        5. 7.3.2.5 SDOUT - Data Output
        6. 7.3.2.6 Device Clocking
          1. 7.3.2.6.1 Clock Rates
          2. 7.3.2.6.2 Clock Halt Auto-recovery
          3. 7.3.2.6.3 Sample Rate on the Fly Change
        7. 7.3.2.7 Clock Error Handling
      3. 7.3.3 Digital Audio Processing
        1. 7.3.3.1 PVDD Foldback
        2. 7.3.3.2 High-Pass Filter
        3. 7.3.3.3 Analog Gain
        4. 7.3.3.4 Digital Volume Control
          1. 7.3.3.4.1 Auto Mute
        5. 7.3.3.5 Gain Compensation Biquads
        6. 7.3.3.6 Low Latency Signal Path
        7. 7.3.3.7 Full Feature Low Latency Path
      4. 7.3.4 Class-D operation and Spread Spectrum Control
        1. 7.3.4.1 1L Modulation
        2. 7.3.4.2 High-Frequency Pulse-Width Modulator (PWM)
        3. 7.3.4.3 Spread Spectrum Control
        4. 7.3.4.4 Gate Drive
        5. 7.3.4.5 Power FETs
      5. 7.3.5 Load Diagnostics
        1. 7.3.5.1 DC Load Diagnostics
          1. 7.3.5.1.1 Automatic DC Load Diagnostics at Device Initialization
          2. 7.3.5.1.2 Automatic DC load diagnostics during Hi-Z or PLAY
          3. 7.3.5.1.3 Manual start of DC load diagnostics
          4. 7.3.5.1.4 Short-to-Ground
          5. 7.3.5.1.5 Short-to-Power
          6. 7.3.5.1.6 Shorted-Load and Open-Load
        2. 7.3.5.2 Line Output Diagnostics
        3. 7.3.5.3 AC Load Diagnostics
          1. 7.3.5.3.1 Operating Principal
          2. 7.3.5.3.2 Stimulus
          3. 7.3.5.3.3 Load Impedance
          4. 7.3.5.3.4 Tweeter Detection
        4. 7.3.5.4 Real-Time Load Diagnostics
        5. 7.3.5.5 DC Resistance Measurement
      6. 7.3.6 Protection and Monitoring
        1. 7.3.6.1 Overcurrent Limit (Cycle-By-Cycle)
        2. 7.3.6.2 Overcurrent Shutdown
        3. 7.3.6.3 Current Sense
        4. 7.3.6.4 DC Detect
        5. 7.3.6.5 Digital Clip Detect
        6. 7.3.6.6 Charge Pump
        7. 7.3.6.7 Temperature Protection and Monitoring
          1. 7.3.6.7.1 Overtemperature Shutdown
          2. 7.3.6.7.2 Overtemperature Warning
          3. 7.3.6.7.3 Thermal Gain Foldback
        8. 7.3.6.8 Power Failures
      7. 7.3.7 Hardware Control Pins
        1. 7.3.7.1 FAULT Pin
        2. 7.3.7.2 PD Pin
        3. 7.3.7.3 STBY Pin
        4. 7.3.7.4 GPIO Pins
          1. 7.3.7.4.1 General Purpose Input
          2. 7.3.7.4.2 General Purpose Output
        5. 7.3.7.5 Advanced GPIO functions
          1. 7.3.7.5.1 Clock Synchronization
            1. 7.3.7.5.1.1 External SYNC signal (GPIO sync)
            2. 7.3.7.5.1.2 Synchronization through the audio serial clock (SCLK)
            3. 7.3.7.5.1.3 TAS6754-Q1 as clock source for external devices
    4. 7.4 Device Functional Modes
      1. 7.4.1 Internal Reporting Signals
        1. 7.4.1.1 Fault Signal
        2. 7.4.1.2 Warning Signal
      2. 7.4.2 Device States and Flags
        1. 7.4.2.1 Audio Channel States
          1. 7.4.2.1.1 SHUTDOWN State
          2. 7.4.2.1.2 DEEP SLEEP State
          3. 7.4.2.1.3 LOAD DIAG State
          4. 7.4.2.1.4 SLEEP State
          5. 7.4.2.1.5 Hi-Z State
          6. 7.4.2.1.6 PLAY State
          7. 7.4.2.1.7 FAULT State
          8. 7.4.2.1.8 Auto Recovery (AUTOREC) State
      3. 7.4.3 Fault Events
        1. 7.4.3.1 Power Fault Events
          1. 7.4.3.1.1 DVDD Power-On-Reset (POR)
          2. 7.4.3.1.2 DVDD Undervoltage Fault
          3. 7.4.3.1.3 VBAT Overvoltage Fault
          4. 7.4.3.1.4 VBAT Undervoltage Fault
          5. 7.4.3.1.5 PVDD Overvoltage Fault
          6. 7.4.3.1.6 PVDD Undervoltage Fault
        2. 7.4.3.2 Overtemperature Shutdown (OTSD) Event
        3. 7.4.3.3 Overcurrent Limit Fault Event
        4. 7.4.3.4 Overcurrent Shutdown Event
        5. 7.4.3.5 DC Fault Event
        6. 7.4.3.6 Clock Error Event
        7. 7.4.3.7 Charge Pump Fault Event
      4. 7.4.4 Warning Events
        1. 7.4.4.1 Overtemperature Warning Event
        2. 7.4.4.2 Overcurrent Limit Warning Event
        3. 7.4.4.3 Clip Detect Warning Event
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Communication Bus
      2. 7.5.2 I2C Address Selection
      3. 7.5.3 I2C Bus Protocol
      4. 7.5.4 Random Write
      5. 7.5.5 Sequential Write
      6. 7.5.6 Random Read
      7. 7.5.7 Sequential Read
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Reconstruction Filter Design
    2. 8.2 Typical Application
      1. 8.2.1 BTL Application
      2. 8.2.2 Power Supply Recommendations
      3. 8.2.3 Power Supply Decoupling
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Electrical Connection of Thermal pad and Heat Sink
        2. 8.3.1.2 EMI Considerations
        3. 8.3.1.3 General Guidelines
      2. 8.3.2 Layout Example
      3. 8.3.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.2 I2C Address Selection

TAS6754-Q1 supports eight I2C addresses, thus up to eight devices can be used together in a system with no additional bus switching hardware.

The pull-up or pull-down resistor connected between the device I2C_ADDR pin and the DVDD-rail (pull-up) or GND (pull-down) determines the I2C address during power up. The I2C address latches after a POR event and is locked until the next POR event.

Table 7-3 I2C Addresses
I2C_ADDR Pin Pull-Up resistorI2C_ADDR Pin Pull-Down resistorI2C WriteI2C Read
-00xE00xE1
-1 kΩ0xE20xE3
-4.7 kΩ0xE40xE5
-24 kΩ0xE60xE7
24 kΩ-0xE80xE9
4.7 kΩ-0xEA0xEB
1 kΩ-0xEC0xED
0-0xEE0xEF