SCPS226C January   2011  – August 2018 TCA4311A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rise-Time Accelerators
      2. 8.3.2 READY Digital Output
      3. 8.3.3 EN Low Current Disable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Connection Circuitry
      3. 8.4.3 Missing ACK Event
        1. 8.4.3.1 System Impact
        2. 8.4.3.2 System Workaround
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Input to Output Offset Voltage
        2. 9.2.1.2 Propagation Delays
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Pull-Up Value Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 Live Insertion and Capacitance Buffering CompactPCI Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
      5. 9.2.5 Live Insertion and Capacitance Buffering PCI Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Curves
      6. 9.2.6 Repeater/Bus Extender Application
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
        3. 9.2.6.3 Application Curves
      7. 9.2.7 Systems With Disparate Supply Voltages
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
        3. 9.2.7.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.1 Resistor Pull-Up Value Selection

The system pull-up resistors must be strong enough to provide a positive slew rate of 1.25 V/μs on the SDA and SCL pins, in order to activate the boost pull-up currents during rising edges. Choose maximum resistor value R using the formula:

Equation 2. R ≤ (VCC(MIN) – 0.6) (800,000) / C

where R is the pull-up resistor value in ohms, VCC(MIN) is the minimum VCC voltage and C is the equivalent bus capacitance in picofarads (pF).

In addition, regardless of the bus capacitance, always choose R ≤ 16 kΩ for VCC = 5.5 V maximum, R ≤ 24 kΩ for VCC = 3.6 V maximum. The start-up circuitry requires logic high voltages on SDAOUT and SCLOUT to connect the backplane to the card, and these pull-up values are needed to overcome the pre-charge voltage.