SCPS225D
August 2011 – April 2021
TCA9509
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
I2C Interface Timing Requirements
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Two-Channel Bidirectional Buffer
9.3.2
Integrated A-Side Current Source
9.3.3
Standard Mode and Fast Mode Support
9.4
Device Functional Modes
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Clock Stretching Support
10.2.2.2
VILC and Pulldown Strength Requirements
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Receiving Notification of Documentation Updates
13.2
Support Resources
13.3
Trademarks
13.4
Electrostatic Discharge Caution
13.5
Glossary
Package Options
Mechanical Data (Package|Pins)
DGK|8
MPDS028E
RVH|8
MPQF272B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scps225d_oa
scps225d_pm
7.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.