SLDS120H March   2000  – March 2022 TFP401 , TFP401A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Digital I/O Electrical Characteristics
    6. 7.6 DC Electrical Characteristics
    7. 7.7 AC Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TMDS Pixel Data and Control Signal Encoding
      2. 9.3.2 TFP401/401A Clocking and Data Synchronization
      3. 9.3.3 TFP401/401A TMDS Input Levels and Input Impedance Matching
      4. 9.3.4 TFP401A Incorporates HSYNC Jitter Immunity
    4. 9.4 Device Functional Modes
      1. 9.4.1 TFP401/401A Modes of Operation
      2. 9.4.2 TFP401/401A Output Driver Configurations
        1. 9.4.2.1 Output Driver Power Down
        2. 9.4.2.2 Drive Strength
        3. 9.4.2.3 Time-Staggered Pixel Output
        4. 9.4.2.4 Power Management
        5. 9.4.2.5 Sync Detect
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Data and Control Signals
        2. 10.2.2.2 Configuration Options
        3. 10.2.2.3 Power Supplies Decoupling
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layer Stack
      2. 12.1.2 Routing High-Speed Differential Signal Traces (RxC–, RxC+, Rx0–, Rx0+, Rx1–, Rx1+, Rx2–, Rx2+)
      3. 12.1.3 DVI Connector
    2. 12.2 Layout Example
    3. 12.3 TI PowerPAD 100-TQFP Package
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (May 2016) to Revision H (March 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added row in Pin function table for thermal padGo
  • Added sentence to end of first paragraph that recommends soldering package thermal pad to PCB in order to minimize stress on peripheral pinsGo

Changes from Revision F (February 2015) to Revision G (May 2016)

Changes from Revision E (July 2013) to Revision F (February 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go