SLOS432B April   2004  – October 2015 THS4281

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, VS = 3 V (VS+ = 3 V, VS- = GND)
    6. 6.6 Electrical Characteristics, VS = 5 V (VS+ = 5 V, VS- = GND)
    7. 6.7 Electrical Characteristics, VS = ±5 V
    8. 6.8 Dissipation Ratings
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 High-Speed Operational Amplifiers
    2. 7.2 Feature Description
      1. 7.2.1 Wideband, Noninverting Operation
      2. 7.2.2 Wideband, Inverting Operation
    3. 7.3 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single-Supply Operation
      2. 8.1.2 Driving Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Active Filtering With the THS4281
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Supply Decoupling Techniques and Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

9.1 Power-Supply Decoupling Techniques and Recommendations

Power-supply decoupling is a critical aspect of any high-performance amplifier design. Careful decoupling provides higher quality ac performance. The following guidelines ensure the highest level of performance.

  1. Place decoupling capacitors as close to the power-supply inputs as possible, with the goal of minimizing the inductance.
  2. Placement priority should put the smallest valued capacitors closest to the device.
  3. Use of solid power and ground planes is recommended to reduce the inductance along power-supply return current paths (with the exception of the areas underneath the input and output pins as noted below).
  4. A bulk decoupling capacitor is recommended (6.8 μF to 22 μF) within 1 inch, and a ceramic (0.1 μF) within 0.1 inch of the power input pins.

NOTE

The bulk capacitor may be shared by other operational amplifiers.