SLLSF20B July   2019  – October 2021 THVD2410 , THVD2450

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings [IEC]
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics: THVD2410
    9. 6.9  Switching Characteristics: THVD2450
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 ±70-V Fault Protection
      2. 8.3.2 Integrated IEC ESD and EFT Protection
      3. 8.3.3 Driver Overvoltage and Overcurrent Protection
      4. 8.3.4 Enhanced Receiver Noise Immunity
      5. 8.3.5 Receiver Fail-Safe Operation
      6. 8.3.6 Low-Power Shutdown Mode
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted). All typical values are at 25°C and supply voltage of VCC = 5 V.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Driver
|VOD|Driver differential output voltage magnitudeRL = 60 Ω, –25 V ≤ Vtest ≤ 25 V (See Figure 7-1)1.53.3V
RL = 60 Ω, –25 V ≤ Vtest ≤ 25 V, 4.5 V ≤ VCC ≤ 5.5 V (See Figure 7-1)2.13.3V
RL = 100 Ω (See Figure 7-2)24V
RL = 54 Ω (See Figure 7-2)1.53.3V
Δ|VOD|Change in differential output voltageRL = 54 Ω or 100 Ω (See Figure 7-2)–5050mV
VOCCommon-mode output voltageRL = 54 Ω or 100 Ω (See Figure 7-2)1VCC/23V
ΔVOC(SS)Change in steady-state common-mode output voltageRL = 54 Ω or 100 Ω (See Figure 7-2)–5050mV
IOSShort-circuit output currentDE = VCC, -70 V ≤ (VA or VB) ≤ 70 V–250250mA
Receiver
IIBus input currentDE = 0 V, VCC = 0 V or 5.5 VDE = 0 V, VCC = 0 V or 5.5 VVI = 12 V75125μA
VI = 25 V150250
VI = –7 V–100–40
VI = –25 V–250–150
VTH+Positive-going input threshold voltage(1)Over common-mode range of ± 25 V40125200mV
VTH-Negative-going input threshold voltage(1)–200–125-40mV
VHYSInput hysteresis250mV
VTH_FSHInput fail-safe threshold–4040mV
CA,BInput differential capacitanceMeasured between A and B, f = 1 MHz50pF
VOHOutput high voltageIOH = –8 mAVCC – 0.4VCC – 0.2V
VOLOutput low voltageIOL = 8 mA0.20.4V
IOZOutput high-impedance currentVO = 0 V or VCC, RE = VCC–11µA
Logic
IINInput current (DE)3 V ≤ VCC ≤ 5.5 V, 0 V ≤ VIN ≤ VCC5µA
IINInput current (D, RE)3 V ≤ VCC ≤ 5.5 V, 0 V ≤ VIN ≤ VCC–5µA
Thermal Protection
TSHDNThermal shutdown thresholdTemperature rising150170°C
THYSThermal shutdown hysteresis10°C
Supply
ICCSupply current (quiescent)Driver and receiver enabledRE = 0 V, DE = VCC, No load3.55.6mA
Driver enabled, receiver disabledRE = VCC, DE = VCC, No load2.54.4mA
Driver disabled, receiver enabledRE = 0 V, DE = 0 V, No load1.82.4mA
Driver and receiver disabledRE = VCC, DE = 0 V, D = open, No load0.11µA
(1) Under any specific conditions, VTH+ is assured to be at least VHYS higher than VTH–.