SLLSEV5D July   2017  – June 2019 TIOL111 , TIOL1113 , TIOL1115

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Wake Up Detection
      2. 8.3.2  Current Limit Configuration
      3. 8.3.3  Current Fault Detection, Indication and Auto Recovery
      4. 8.3.4  Thermal Warning, Thermal Shutdown
      5. 8.3.5  Fault Reporting (NFAULT)
      6. 8.3.6  Transceiver Function Tables
      7. 8.3.7  The Integrated Voltage Regulator (LDO)
      8. 8.3.8  Reverse Polarity Protection
      9. 8.3.9  Integrated Surge Protection and Transient Waveform Tolerance
      10. 8.3.10 Power Up Sequence (TIOL111)
      11. 8.3.11 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch SIO Mode)
      2. 8.4.2 PNP Configuration (P-Switch SIO Mode)
      3. 8.4.3 Push-Pull, Communication Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Junction Temperature Check
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.1 Maximum Junction Temperature Check

For a 200 mA current limit:

  • The maximum driver output current limit, IO(LIM) = 250 mA (allowed for current limit tolerance).
  • The maximum voltage drop is given with VDS(ON) = 1.75 V.

This causes a power consumption of:

Equation 1. TIOL111 TIOL1113 TIOL1115 eq3_sllsev5.gif

For a 5 mA LDO current output,

Equation 2. TIOL111 TIOL1113 TIOL1115 eq4_sllsev5.gif

Total power dissipation,

Equation 3. TIOL111 TIOL1113 TIOL1115 eq5_sllsev5.gif

Multiply this value with the Junction-to-ambient thermal resistance of θJA = 68.1°C/W (taken from the Thermal Information table) to receive the difference between junction temperature, TJ, and ambient temperature, TA:

Equation 4. TIOL111 TIOL1113 TIOL1115 eq6_sllsev5.gif

Add this value to the maximum ambient temperature of TA = 105°C to receive the final junction temperature:

Equation 5. TIOL111 TIOL1113 TIOL1115 eq7_sllsev5.gif

As long as TJ-max is below the recommended maximum value of 150°C, no thermal shutdown will occur. However, thermal warning may occur as the junction temperature is greater than TWRN.

Note that the modeling of the complete system may be necessary to predict junction temperature in smaller PCBs and/or enclosures without air flow.