SLVSA79A April   2010  – September 2016 TL1963A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Operation
      2. 7.3.2 Output Capacitance and Transient Response
      3. 7.3.3 Overload Recovery
      4. 7.3.4 Output Voltage Noise
      5. 7.3.5 Protection Features
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Capacitance and Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Adjustable Output Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Fixed Operation
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Paralleling Regulators for Higher Output Current
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Calculating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The power handling capability of the device is limited by the maximum rated junction temperature (125°C). The power dissipated by the device is made up of two components:

  1. Output current multiplied by the input and output voltage differential: IOUT(VIN – VOUT).
  2. GND pin current multiplied by the input voltage: IGNDVIN.

The GND pin current can be found using the GND Pin Current graphs in Typical Characteristics. Power dissipation is equal to the sum of the two components listed above.

The TL1963A-Q1 series regulators have internal thermal limiting designed to protect the device during overload conditions. For continuous normal conditions, the maximum junction temperature rating of 125°C must not be exceeded. It is important to carefully consider all sources of thermal resistance from junction to ambient. Additional heat sources mounted nearby must also be considered.

For surface-mount devices, heat sinking is accomplished by using the heat-spreading capabilities of the PCB and its copper traces. Copper board stiffeners and plated through-holes also can be used to spread the heat generated by power devices.

Table 4 lists thermal resistance for several different board sizes and copper areas. All measurements were taken in still air on 1/16-inch FR-4 board with one-ounce copper.

Table 4. KTT Package (5-Pin TO-263)

COPPER AREA BOARD AREA THERMAL RESISTANCE
(JUNCTION TO AMBIENT)
TOPSIDE(1) BACKSIDE
2500 mm2 2500 mm2 2500 mm2 23°C/W
1000 mm2 2500 mm2 2500 mm2 25°C/W
125 mm2 2500 mm2 2500 mm2 33°C/W
(1) Device is mounted on topside.