SLOS487A June   2007  – March 2025

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-19DC26E8-D6A2-4DC2-B060-CBAB9083A539/SLCS1465781
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 TL4051x12I Electrical Characteristics
    5. 5.5 TL4051x12Q Electrical Characteristics
    6. 5.6 TL4051xI (Adjustable Version) Electrical Characteristics
    7. 5.7 TL4051xQ (Adjustable Version) Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Functional Block Diagram
  8. Application Information
    1.     18
    2. 7.1 Output Capacitor
    3. 7.2 SOT-23 Pin Connections
    4. 7.3 Adjustable Version
    5. 7.4 Cathode and Load Currents
  9. Device and Documentation Support
    1. 8.1 Ordering Information #GUID-976CEE24-7363-4E17-A58C-B4BF51CF6EAF/SLOS4878286
    2. 8.2 Ordering Information #GUID-673FAB83-2025-46A0-94B9-74C174333480/SLOS4875645
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings(1)

over free-air temperature range (unless otherwise noted)
MINMAXUNIT
VZContinuous cathode voltage15V
IZContinuous cathode current–1020mA
θJAPackage thermal impedance(2)(3)DBZ package206°C/W
DCK package252
TJOperating virtual junction temperature150°C
TstgStorage temperature range–65150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.