SGLS156F March   2003  – December 2016 TLC3702-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LinCMOS™ Process
      2. 8.3.2 Electrostatic Discharge
      3. 8.3.3 Input Protection Circuit Operation
      4. 8.3.4 Positive ESD Transients
      5. 8.3.5 Negative ESD Transients
      6. 8.3.6 Circuit-Design Considerations
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Achieving Greater Noise Immunity
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Two-Phase Non-Overlapping Clock Generator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VDD (2) −0.3 18 V
Differential input voltage, VID(3) ±18 V
Input voltage, VI −0.3 VDD V
Output voltage, VO −0.3 VDD V
Input current, II ±5 mA
Output current, IO (each output) ±20 mA
Total supply current into VDD 40 mA
Total current out of GND 40 mA
Continuous total power dissipation See Thermal Information
Operating free-air temperature, TA −40 125 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds D package 260 °C
PW package 260
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to GND.
(3) Differential voltages are at IN+ with respect to IN−.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) All pins ±2000 V
Charged-device model (CDM), per AEC Q100-011 All pins except 1, 4, 5, and 8 ±500
Pins 1, 4, 5, and 8 ±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VDD Supply voltage 4 5 16 V
VIC Common-mode input voltage 0 VDD - 1.5 V
IOH High-level output current –20 mA
IOL Low-level output current 20 mA
TA Operating free-air temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TLC3702-Q1 UNIT
D (SOIC) PW (TSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 117.7 181.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.9 49.9 °C/W
RθJB Junction-to-board thermal resistance 57.8 110.1 °C/W
ψJT Junction-to-top characterization parameter 15.3 2.4 °C/W
ψJB Junction-to-board characterization parameter 57.3 108.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at specified operating free-air temperature range, VDD = 5 V (unless otherwise noted). See (2)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
VIO Input offset voltage VDD = 5 V to 10 V,
VIC = VICRmin, See (1)		 25°C 1.2 5 mV
−40°C to +125°C 10
IIO Input offset current VIC = 2.5 V 25°C 1 pA
125°C 15
IIB Input bias current VIC = 2.5 V 25°C 5 pA
125°C 30 nA
VICR Common-mode input voltage range 25°C 0 to VDD − 1 V
−40°C to +125°C 0 to VDD − 1.5
CMRR Common-mode rejection ratio VIC = VICRmin 25°C 84 dB
125°C 83
−40°C 82
kSVR Supply-voltage rejection ratio VDD = 5 V to 10 V 25°C 85 dB
125°C 85
−40°C 82
VOH High-level output voltage VID = 1 V, IOH = −4 mA 25°C 4.5 V
125°C 4.2
VOL Low-level output voltage VID = 1 V, IOH = −4 mA 25°C 210 300 mV
125°C 500
IDD Supply current (both comparators) Outputs low, No load 25°C 19 40 µA
−40°C to +125°C 90
(1) The offset voltage limits given are the maximum values required to drive the output up to 4.5 V or down to 0.3 V.
(2) All characteristics are measured with zero common-mode voltage unless otherwise noted.

6.6 Switching Characteristics

at recommended operating conditions, VDD = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t(PLH) Propagation response time, low-to-high-level output (1) f = 10 kHz,
CL = 50 pF		 Overdrive = 2 mV 4.5 µs
Overdrive = 5 mV 2.7
Overdrive = 10 mV 1.9
Overdrive = 20 mV 1.4
Overdrive = 40 mV 1.1
VI = 1.4 V step at IN+ 1.1 µs
t(PHL) Propagation response time, high-to-low-level output (1) f = 10 kHz,
CL = 50 pF		 Overdrive = 2 mV 4
Overdrive = 5 mV 2.3
Overdrive = 10 mV 1.5
Overdrive = 20 mV 0.95
Overdrive = 40 mV 0.65
VI = 1.4 V step at IN+ 0.15
tf Fall time f = 10 kHz,
CL = 50 pF		 Overdrive = 50 mV 50 ns
tr Rise time f = 10 kHz,
CL = 50 pF		 Overdrive = 50 mV 125 ns
(1) Simultaneous switching of inputs causes degradation in output response.

6.7 Typical Characteristics

Table 1. Table of Graphs

FIGURE
VIO Input offset voltage Distribution Figure 1
IIB Input bias current vs Free-air temperature Figure 2
CMRR Common-mode rejection ratio vs Free-air temperature Figure 3
kSVR Supply-voltage rejection ratio vs Free-air temperature Figure 4
VOH High-level output current vs Free-air temperature Figure 5
vs High-level output current Figure 6
VOL Low-level output voltage vs Low-level output current Figure 7
vs Free-air temperature Figure 8
tt Transition time vs Load capacitance Figure 9
Supply current response vs Time Figure 10
Low-to-high-level output response Low-to-high level output propagation delay time Figure 11
High-to-low level output response High-to-low level output propagation delay time Figure 12
tPLH Low-to-high level output propagation delay time vs Supply voltage Figure 13
tPHL High-to-low level output propagation delay time vs Supply voltage Figure 14
IDD Supply current vs Frequency Figure 15
vs Supply voltage Figure 16
vs Free-air temperature Figure 17
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the device.
TLC3702-Q1 typchar_08_gls156.gif Figure 1. Distribution of Input Offset Voltage
TLC3702-Q1 typchar_10_gls156.gif Figure 3. Common-Mode Rejection Ratio vs Free-Air Temperature
TLC3702-Q1 typchar_12_gls156.gif Figure 5. High-Level Output Current vs Free-Air Temperature
TLC3702-Q1 typchar_14_gls156.gif Figure 7. Low-Level Output Voltage vs Low-Level Output Current
TLC3702-Q1 typchar_16_gls156.gif Figure 9. Output Transition Time vs Load Capacitance
TLC3702-Q1 typchar_18_gls156.gif Figure 11. Low-to-High-Level Output Response for Various Input Overdrives
TLC3702-Q1 typchar_20_gls156.gif Figure 13. Low-to-High-Level Output Response Time vs Supply Voltage
TLC3702-Q1 typchar_22_gls156.gif Figure 15. Average Supply Current (per Comparator) vs Frequency
TLC3702-Q1 typchar_24_gls156.gif Figure 17. Supply Current vs Free-Air Temperature
TLC3702-Q1 typchar_09_gls156.gif Figure 2. Input Bias Current vs Free-Air Temperature
TLC3702-Q1 typchar_11_gls156.gif Figure 4. Supply-Voltage Rejection Ratio vs Free-Air Temperature
TLC3702-Q1 typchar_13_gls156.gif Figure 6. High-Level Output Current vs High-Level Output Current
TLC3702-Q1 typchar_15_gls156.gif Figure 8. Low-Level Output Voltage vs Free-Air Temperature
TLC3702-Q1 typchar_17_gls156.gif Figure 10. Supply Current Response to an Output Voltage Transition
TLC3702-Q1 typchar_19_gls156.gif Figure 12. High-to-Low-Level Output Response for Various Input Overdrives
TLC3702-Q1 typchar_21_gls156.gif Figure 14. High-to-Low-Level Output Response Time vs Supply Voltage
TLC3702-Q1 typchar_23_gls156.gif Figure 16. Supply Current vs Supply Voltage