SLDS156B March   2009  – July 2015 TLC59108

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection
      2. 9.3.2 Overtemperature Detection and Shutdown
      3. 9.3.3 Power-On Reset
      4. 9.3.4 External Reset
      5. 9.3.5 Software Reset
      6. 9.3.6 Individual Brightness Control With Group Dimming/Blinking
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 Characteristics of the I2C Bus
        1. 9.5.1.1 Bit Transfer
        2. 9.5.1.2 Start and Stop Conditions
      2. 9.5.2 System Configuration
      3. 9.5.3 Acknowledge
      4. 9.5.4 Device Address
      5. 9.5.5 Regular I2C Bus Slave Address
      6. 9.5.6 LED All Call I2C Bus Address
      7. 9.5.7 LED Sub Call I2C Bus Address
      8. 9.5.8 Software Reset I2C Bus Address
      9. 9.5.9 Control Register
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1  Mode Register 1 (MODE1)
        2. 9.6.1.2  Mode Register 2 (MODE2)
        3. 9.6.1.3  Brightness Control Registers 0 to 7 (PWM0 to PWM7)
        4. 9.6.1.4  Group Duty Cycle Control Register (GRPPWM)
        5. 9.6.1.5  Group Frequency Register (GRPFREQ)
        6. 9.6.1.6  LED Driver Output State Registers (LEDOUT0, LEDOUT1)
        7. 9.6.1.7  I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
        8. 9.6.1.8  LED All Call I2C Bus Address Register (ALLCALLADR)
        9. 9.6.1.9  Output Gain Control Register (IREF)
        10. 9.6.1.10 Error Flags Registers (EFLAG)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driver Output
        1. 10.1.1.1 Constant Current Output
        2. 10.1.1.2 Adjusting Output Current
      2. 10.1.2 TLC59108 and TLC59108F Differences
    2. 10.2 Typical Application
      1. 10.2.1 Parallel Outputs
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Multiple Devices
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

The I2C signals (SDA / SCL) should be kept away from potential noise sources.

The traces carrying power through the LEDs should be wide enough to handle the necessary current.

All LED current passes through the device and into the ground node. There must be a strong connection between the device ground and the circuit board ground. For the RGY package, the thermal pad should be connected to the ground to help dissipate heat.

12.2 Layout Examples

TLC59108 layout_ex_01_slds156.gifFigure 27. Layout Example for RGY Package
TLC59108 layout_ex_02_slds156.gifFigure 28. Layout Example for PW Package