SLDS223A March   2016  – March  2016 TLC59116-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection
      2. 9.3.2 Overtemperature Detection and Shutdown
      3. 9.3.3 Power-On Reset (POR)
      4. 9.3.4 External Reset
      5. 9.3.5 Software Reset
      6. 9.3.6 Individual Brightness Control With Group Dimming/Blinking
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active
      2. 9.4.2 Standby
    5. 9.5 Programming
      1. 9.5.1 Characteristics of the I2C Bus
        1. 9.5.1.1 Bit Transfer
        2. 9.5.1.2 Start and Stop Conditions
        3. 9.5.1.3 Acknowledge
      2. 9.5.2 System Configuration
      3. 9.5.3 Device Address
      4. 9.5.4 Regular I2C Bus Slave Address
      5. 9.5.5 LED All Call I2C Bus Address
      6. 9.5.6 LED Sub Call I2C Bus Address
      7. 9.5.7 Software Reset I2C Bus Address
      8. 9.5.8 Control Register
    6. 9.6 Register Maps
      1. 9.6.1  Mode Register 1 (MODE1)
      2. 9.6.2  Mode Register 2 (MODE2)
      3. 9.6.3  Brightness Control Registers 0 to 15 (PWM0 to PWM15)
      4. 9.6.4  Group Duty Cycle Control Register (GRPPWM)
      5. 9.6.5  Group Frequency Register (GRPFREQ)
      6. 9.6.6  LED Driver Output State Registers 0 to 3 (LEDOUT0 to LEDOUT3)
      7. 9.6.7  I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
      8. 9.6.8  LED All Call I2C Bus Address Register (ALLCALLADR)
      9. 9.6.9  Output Gain Control Register (IREF)
      10. 9.6.10 Error Flags Registers (EFLAG1, EFLAG2)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Constant Current Output
      2. 10.1.2 Adjusting Output Current
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

Documentation Support

Related Documentation

For related documentation see the following:

13.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.