SLLSEU9D June   2019  – June 2022 TLIN1021-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Power Supply Characteristics
    6. 7.6 Electrical Characteristics
    7. 7.7 AC Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD
      3. 9.3.3  RXD
      4. 9.3.4  VSUP
      5. 9.3.5  GND
      6. 9.3.6  EN
      7. 9.3.7  WAKE
      8. 9.3.8  INH
      9. 9.3.9  Local Faults
      10. 9.3.10 TXD Dominant Time-Out (DTO)
      11. 9.3.11 Bus Stuck Dominant System Fault: False Wake-Up Lockout
      12. 9.3.12 Thermal Shutdown
      13. 9.3.13 Under Voltage on VSUP
      14. 9.3.14 Unpowered Device
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Local Wake-Up (LWU) via WAKE Input Terminal
        2. 9.4.4.2 Wake-Up Request (RXD)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Normal Mode Application Note
        2. 10.2.2.2 TXD Dominant State Time-Out Application Note
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4.     Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 D Package, 8-Pin (SOIC)
(Top View)
Figure 6-2 DRB Package, 8-Pin (VSON)
(Top View)
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
RXD 1 Digital LIN receive data output, open-drain
EN 2 Digital Sleep mode control input, integrated pull-down
WAKE 3 High Voltage Local wake-up input, high voltage
TXD 4 Digital LIN transmit data input, integrated pulled down - active low after a local wake-up event
GND 5 GND Ground connection
LIN 6 Bus IO LIN bus input/output line
VSUP 7 Supply High-voltage supply from the battery
INH 8 High Voltage Inhibit output to control system voltage regulators and supplies, high voltage
Thermal Pad — Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief