SLVS561L December   2004  – October 2014 TLV1117

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Handling Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 TLV1117C Electrical Characteristics
    4. 6.4 TLV1117I Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 NPN Output Drive
      2. 7.3.2 Overload Block
      3. 7.3.3 Programmable Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal operation
      2. 7.4.2 Operation With Low Input Voltage
      3. 7.4.3 Operation at Light Loads
      4. 7.4.4 Operation in Self Protection
  8. Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
      3. 8.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KVU|3
  • DRJ|8
  • DCY|4
  • KCS|3
  • KCT|3
  • KTT|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.0.1 Trademarks

All trademarks are the property of their respective owners.

11.0.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.1 Glossary

SLYZ022 TI Glossary.

This glossary lists and explains terms, acronyms and definitions.