SBVS160C May   2011  – January 2023 TLV1117LV

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Protection
        2. 8.5.1.2 Power Dissipation
      2. 8.5.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
        2. 9.1.1.2 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at VIN = VOUT(nom) + 1.5 V, IOUT = 10 mA, COUT = 1.0 μF, and TA = 25°C (unless otherwise noted)

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Figure 6-1 Line Regulation
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Figure 6-3 Load Regulation
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Figure 6-5 Dropout Voltage vs Output Current
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Figure 6-7 Quiescent Current vs Load
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Figure 6-9 Power-Supply Rejection Ratio vs Frequency
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Figure 6-11 Power-Supply Rejection Ratio vs Output Current
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COUT = 1 μF
Figure 6-13 Load Transient Response 200 mA to 500 mA
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COUT = 1 μF
Figure 6-15 Load Transient Response 1 mA to 500 mA
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COUT = 1 μF
Figure 6-17 Load Transient Response 200 mA to 1 A
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COUT = 1 μF
Figure 6-19 Load Transient Response 1 mA to 1 A
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VOUT = 1.8 V, IOUT = 10 mA
Figure 6-21 Line Transient Response
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VOUT = 1.8 V, IOUT = 1 A
Figure 6-23 Line Transient Response
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VOUT = 1.8 V, IOUT = 500 mA
Figure 6-25 Line Transient Response
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Figure 6-2 Line Regulation
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Figure 6-4 Dropout Voltage vs Input Voltage
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Figure 6-6 Output Voltage vs Temperature
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Figure 6-8 Current Limit vs Input Voltage
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Figure 6-10 Power-Supply Rejection Ratio vs Frequency
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Figure 6-12 Spectral Noise Density vs Frequency
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COUT = 10 μF
Figure 6-14 Load Transient Response 200 mA to 500 mA
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COUT = 10 μF
Figure 6-16 Load Transient Response 1 mA to 500 mA
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COUT = 10 μF
Figure 6-18 Load Transient Response 200 mA to 1 A
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COUT = 10 μF
Figure 6-20 Load Transient Response 1 mA to 1 A
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VOUT = 1.8 V, IOUT = 500 mA
Figure 6-22 Line Transient Response
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VOUT = 1.8 V, IOUT = 10 mA
Figure 6-24 Line Transient Response
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VOUT = 1.8 V, IOUT = 1 A
Figure 6-26 Line Transient Response