SBOS753B June   2016  – February 2017 TLV2313 , TLV313 , TLV4313

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TLV313
    5. 7.5  Thermal Information: TLV2313
    6. 7.6  Thermal Information: TLV4313
    7. 7.7  Electrical Characteristics: 5.5 V
    8. 7.8  Electrical Characteristics: 1.8 V
    9. 7.9  Typical Characteristics: Table of Graphs
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 EMI Susceptibility and Input Filtering
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Precision Amplifier for Cost-Sensitive Systems
  • Low IQ: 65 µA/ch
  • Wide Supply Range: 1.8 V to 5.5 V
  • Low Noise: 26 nV/√Hz at 1 kHz
  • Gain Bandwidth: 1 MHz
  • Rail-to-Rail Input/Output
  • Low Input Bias Current: 1 pA
  • Low Offset Voltage: 0.75 mV
  • Unity-Gain Stable
  • Internal RF/EMI Filter
  • Extended Temperature Range:
    –40°C to +125°C

2 Applications

  • Medical and Healthcare
  • Fitness and Wearable Electronics
  • Utility Metering (Heat, Water, Energy)
  • Building Automation Equipment
  • Currency Counters

CMRR and PSRR vs Temperature

TLV313 TLV2313 TLV4313 C010_SBOS649.png

3 Description

The TLV313 family of single-, dual-, and quad-channel precision operational amplifiers combine low power consumption with good performance. This makes them suitable for a wide range of applications, such as wearables, utility metering, building automation, currency counters and more. The family features rail-to-rail input and output (RRIO) swings, low quiescent current (65 μA, typical), wide bandwidth (1 MHz) and very low noise (26 nV/√Hz at 1 kHz), making it attractive for a variety of battery-powered applications that require a good balance between cost and performance. Further, low-input-bias current enables these devices to be used in applications with megaohm source impedances.

The robust design of the TLV313 devices provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

The devices are optimized for operation at voltages as low as +1.8 V (±0.9 V) and up to +5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C.

The single-channel TLV313 device is available in both SC70-5 and SOT23-5 packages. The dual-channel TLV2313 device is offered in SOIC-8 and VSSOP-8 packages, and the quad-channel TLV4313 device is offered in a TSSOP-14 package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV313 SC70 (5) 2.00 mm × 1.25 mm
SOT23 (5) 2.90 mm × 1.60 mm
TLV2313 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
TLV4313 TSSOP (14) 5.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Revision History

Changes from A Revision (June 2016) to B Revision

  • Changed pin assignment for DCK packageGo

Changes from * Revision (June 2016) to A Revision

  • Changed Product Status from Product Preview to Production Data Go
  • Changed the formatting of the Related Documentation section Go
  • Changed wording in the Receiving Notification of Documentation Updates section Go