2-Channel, 1MHz, RRIO, low power, cost-optimized 5.5V CMOS op amp
Product details
Parameters
Package | Pins | Size
Features
- Precision Amplifier for Cost-Sensitive Systems
- Low IQ: 65 µA/ch
- Wide Supply Range: 1.8 V to 5.5 V
- Low Noise: 26 nV/√Hz at 1 kHz
- Gain Bandwidth: 1 MHz
- Rail-to-Rail Input/Output
- Low Input Bias Current: 1 pA
- Low Offset Voltage: 0.75 mV
- Unity-Gain Stable
- Internal RF/EMI Filter
- Extended Temperature Range:
–40°C to +125°C
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Description
The TLV313 family of single-, dual-, and quad-channel precision operational amplifiers combine low power consumption with good performance. This makes them suitable for a wide range of applications, such as wearables, utility metering, building automation, currency counters and more. The family features rail-to-rail input and output (RRIO) swings, low quiescent current (65 µA, typical), wide bandwidth (1 MHz) and very low noise (26 nV/√Hz at 1 kHz), making it attractive for a variety of battery-powered applications that require a good balance between cost and performance. Further, low-input-bias current enables these devices to be used in applications with megaohm source impedances.
The robust design of the TLV313 devices provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).
The devices are optimized for operation at voltages as low as +1.8 V (±0.9 V) and up to +5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C.
The single-channel TLV313 device is available in both SC70-5 and SOT23-5 packages. The dual-channel TLV2313 device is offered in SOIC-8 and VSSOP-8 packages, and the quad-channel TLV4313 device is offered in a TSSOP-14 package.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TLVx313 Low-Power, Rail-to-Rail In/Out, 500-µV Typical Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems datasheet (Rev. B) | Feb. 22, 2017 |
| Technical articles | What is an op amp? | Jan. 21, 2020 | |
| Technical articles | Designing tiny microphone circuits with the industry’s smallest op amp | Apr. 12, 2018 | |
| Technical articles | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
| Technical articles | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
| White papers | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The TI Precision Amplifier Quickstart Kit simplifies op amp selection, design, and evaluation with samples of six op amps and an evaluation module for prototyping surface-mount ICs. The kit is the perfect starting point for your amplifier designs.
You may also be interested in TI Precision Labs, the (...)
Features
The kit includes:
- Six samples: Three low-power, low-voltage amplifiers and three low-power, wide-supply amplifiers. See the table below for the complete list.
- DIP Adapter Evaluation Module (DIP-ADAPTER-EVM) for prototyping surface-mount ICs. The EVM supports the following package types: D or U (...)
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- 10 circuit configurations to choose from: Non-Inverting, Inverting, Active Filters, Difference Amplifier with Reference Buffer, and more!
- Multiple interface options: SMA, Header, Breadboard, Wire
- Designed for 0805 size components; 0603 size friendly
- Circuit schematic provided in silkscreen on the back (...)
Description
The Universal OPAMPEVM is a series of general purpose blank circuit boards that simplify prototyping circuits for a variety of IC package types. The evaluation module board design allows many different circuits to be constructed easily and quickly. Five models are offered with each targeted for (...)
Design tools & simulation
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
Reference designs
Design files
-
download TIDA-01519 BOM.pdf (19KB) -
download TIDA-01519 Assembly Drawing.pdf (439KB) -
download TIDA-01519 PCB.pdf (2092KB) -
download TIDA-01519 CAD Files.zip (1460KB) -
download TIDA-01519 Gerber.zip (2094KB)
Design files
-
download TIDA-01070 BOM.pdf (67KB) -
download TIDA-01070 Assembly Drawing.pdf (428KB) -
download TIDA-01070 PCB.pdf (2425KB) -
download TIDA-01070 CAD Files.zip (2121KB) -
download TIDA-01070 Gerber.zip (628KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| SOIC (D) | 8 | View options |
| VSSOP (DGK) | 8 | View options |
Ordering & quality
Support & training
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