The TLV313 family of single-, dual-, and quad-channel precision operational amplifiers combine low power consumption with good performance. This makes them suitable for a wide range of applications, such as wearables, utility metering, building automation, currency counters and more. The family features rail-to-rail input and output (RRIO) swings, low quiescent current (65 µA, typical), wide bandwidth (1 MHz) and very low noise (26 nV/√Hz at 1 kHz), making it attractive for a variety of battery-powered applications that require a good balance between cost and performance. Further, low-input-bias current enables these devices to be used in applications with megaohm source impedances.
The robust design of the TLV313 devices provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).
The devices are optimized for operation at voltages as low as +1.8 V (±0.9 V) and up to +5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C.
The single-channel TLV313 device is available in both SC70-5 and SOT23-5 packages. The dual-channel TLV2313 device is offered in SOIC-8 and VSSOP-8 packages, and the quad-channel TLV4313 device is offered in a TSSOP-14 package.
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| Part number | Order | Number of channels (#) | Total supply voltage (Min) (+5V=5, +/-5V=10) | Total supply voltage (Max) (+5V=5, +/-5V=10) | GBW (Typ) (MHz) | Slew rate (Typ) (V/us) | Rail-to-rail | Vos (offset voltage @ 25 C) (Max) (mV) | Iq per channel (Typ) (mA) | Vn at 1 kHz (Typ) (nV/rtHz) | Rating | Operating temperature range (C) | Package Group | Package size: mm2:W x L (PKG) | Offset drift (Typ) (uV/C) | Features | Input bias current (Max) (pA) | CMRR (Typ) (dB) | Output current (Typ) (mA) | Architecture |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TLV2313 |
|
2 | 1.8 | 5.5 | 1 | 0.5 |
In
Out |
3 | 0.065 | 26 | Catalog | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened |
85 | 15 | CMOS | |
| OPA2313 |
|
2 | 1.8 | 5.5 | 1 | 0.5 |
In
Out |
2.5 | 0.05 | 25 | Catalog | -40 to 125 |
SOIC | 8
SON | 8 VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SON: 9 mm2: 3 x 3 (SON | 8) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
EMI Hardened
Small Size |
10 | 80 | 15 | CMOS |
| TLV9002 |
|
2 | 1.8 | 5.5 | 1 | 2 |
In
Out |
1.5 | 0.06 | 28 | Catalog | -40 to 125 |
SOIC | 8
SOT-23-THIN | 8 TSSOP | 8 VSSOP | 10 VSSOP | 8 WSON | 8 X2QFN | 10 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SOT-23-THIN: 8 mm2: 2.8 x 2.9 (SOT-23-THIN | 8) 8TSSOP: 19 mm2: 6.4 x 3 (TSSOP | 8) 10VSSOP: 9 mm2: 3 x 3 (VSSOP | 10) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) 8WSON: 4 mm2: 2 x 2 (WSON | 8) 10X2QFN: 3 mm2: 2 x 1.5 (X2QFN | 10) |
0.6 |
Cost Optimized
EMI Hardened Shutdown Small Size |
90 | 40 | CMOS | |
| TLV9062 |
|
2 | 1.8 | 5.5 | 10 | 6.5 |
In
Out |
1.6 | 0.538 | 16 | Catalog | -40 to 125 |
SOIC | 8
SOT-23-THIN | 8 TSSOP | 8 VSSOP | 10 VSSOP | 8 WSON | 8 X2QFN | 10 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SOT-23-THIN: 8 mm2: 2.8 x 2.9 (SOT-23-THIN | 8) 8TSSOP: 19 mm2: 6.4 x 3 (TSSOP | 8) 10VSSOP: 9 mm2: 3 x 3 (VSSOP | 10) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) 8WSON: 4 mm2: 2 x 2 (WSON | 8) 10X2QFN: 3 mm2: 2 x 1.5 (X2QFN | 10) |
0.53 |
Cost Optimized
EMI Hardened Shutdown Small Size |
103 | 50 | CMOS |
