SLOS270F March   2001  – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Tables
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Thermal Information: TLV2370
    4. 7.4  Thermal Information: TLV2371
    5. 7.5  Thermal Information: TLV2372
    6. 7.6  Thermal Information: TLV2373
    7. 7.7  Thermal Information: TLV2374
    8. 7.8  Thermal Information: TLV2375
    9. 7.9  Electrical Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input Operation
      2. 8.3.2 Driving a Capacitive Load
      3. 8.3.3 Offset Voltage
      4. 8.3.4 General Configurations
      5. 8.3.5 Shutdown Function
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Tables

Table 1. Selection of Signal Amplifier Products(1)

DEVICE VDD
(V)		 VIO
(µV)		 IQ/Ch
(µA)		 IIB
(pA)		 GBW
(MHz)		 SR
(V/µs)		 SHUTDOWN RAIL-TO-RAIL SINGLES,
DUALS,
QUADS
TLV237x 2.7 to 16 500 550 1 3 2.4 Yes I/O S, D, Q
TLC227x 4 to 16 300 1100 1 2.2 3.6 — O D, Q
TLV27x 2.7 to 16 500 550 1 3 2.4 — O S, D, Q
TLC27x 3 to 16 1100 675 1 1.7 3.6 — — S, D, Q
TLV246x 2.7 to 16 150 550 1300 6.4 1.6 Yes I/O S, D, Q
TLV247x 2.7 to 16 250 600 2 2.8 1.5 Yes I/O S, D, Q
TLV244x 2.7 to 10 300 725 1 1.8 1.4 — O D, Q
(1) Typical values measured at 5 V and 25°C.

Table 2. Family Package Table(1)

DEVICE NUMBER OF CHANNELS PACKAGE TYPES SHUTDOWN UNIVERSAL EVM BOARD
PDIP SOIC SOT-23 TSSOP MSOP
TLV2370 1 8 8 6 — — Yes See the EVM Selection Guide
TLV2371 1 8 8 5 — — —
TLV2372 2 8 8 — — 8 —
TLV2373 2 14 14 — — 10 Yes
TLV2374 4 14 14 — 14 — —
TLV2375 4 16 16 — 16 — Yes
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.