SGLS182C September   2003  – July 2025 TLV2432-Q1 , TLV2432A-Q1 , TLV2434A-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Ordering Information
    1.     6
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics: VDD = 3 V
    5. 5.5 Operating Characteristics: VDD = 3 V
    6. 5.6 Electrical Characteristics: VDD = 5 V
    7. 5.7 Operating Characteristics: VDD = 5 V
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Macromodel Information
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Trademarks

Advanced LinCMOS and TI E2E™ are trademarks of Texas Instruments.

Microsim Parts™ is a trademark of MicroSim.

All trademarks are the property of their respective owners.