SLOS602E September   2008  – September 2019 TLV320AIC3204

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, ADC
    6. 7.6  Electrical Characteristics, Bypass Outputs
    7. 7.7  Electrical Characteristics, Microphone Interface
    8. 7.8  Electrical Characteristics, Audio DAC Outputs
    9. 7.9  Electrical Characteristics, LDO
    10. 7.10 Electrical Characteristics, Misc.
    11. 7.11 Electrical Characteristics, Logic Levels
    12. 7.12 I2S LJF and RJF Timing in Master Mode (see )
    13. 7.13 I2S LJF and RJF Timing in Slave Mode (see )
    14. 7.14 DSP Timing in Master Mode (see )
    15. 7.15 DSP Timing in Slave Mode (see )
    16. 7.16 Digital Microphone PDM Timing (see )
    17. 7.17 I2C Interface Timing
    18. 7.18 SPI Interface Timing (See )
    19. 7.19 Typical Characteristics
    20. 7.20 Typical Characteristics, FFT
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Connections
        1. 9.3.1.1 Digital Pins
          1. 9.3.1.1.1 Multifunction Pins
        2. 9.3.1.2 Analog Pins
      2. 9.3.2 Analog Audio IO
        1. 9.3.2.1 Analog Low Power Bypass
        2. 9.3.2.2 ADC Bypass Using Mixer Amplifiers
        3. 9.3.2.3 Headphone Outputs
        4. 9.3.2.4 Line Outputs
      3. 9.3.3 ADC
        1. 9.3.3.1 ADC Processing
          1. 9.3.3.1.1 ADC Processing Blocks
      4. 9.3.4 DAC
        1. 9.3.4.1 DAC Processing Blocks
      5. 9.3.5 PowerTune
      6. 9.3.6 Digital Audio IO Interface
      7. 9.3.7 Clock Generation and PLL
      8. 9.3.8 Control Interfaces
        1. 9.3.8.1 I2C Control
        2. 9.3.8.2 SPI Control
    4. 9.4 Device Functional Modes
    5. 9.5 Register Map
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Reference Filtering Capacitor
        2. 10.2.1.2 MICBIAS
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Analog Input Connection
        2. 10.2.2.2 Analog Output Connection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.2.3 Headphone Outputs

The stereo headphone drivers on pins HPL and HPR can drive loads with impedances down to 16Ω in single-ended AC-coupled headphone configurations, or loads down to 32Ω in differential mode, where a speaker is connected between HPL and HPR. In single-ended drive configuration these drivers can drive up to 15mW power into each headphone channel while operating from 1.8V analog supplies. While running from the AVDD supply, the output common-mode of the headphone driver is set by the common-mode setting of analog inputs in Page 1, Register 10, Bit D6, to allow maximum utilization of the analog supply range while simultaneously providing a higher output-voltage swing. In cases when higher output-voltage swing is required, the headphone amplifiers can run directly from the higher supply voltage on LDOIN input (up to 3.6V). To use the higher supply voltage for higher output signal swing, the output common-mode can be adjusted to either 1.25V, 1.5V or 1.65V by configuring Page 1, Register 10, Bits D5-D4. When the common-mode voltage is configured at 1.65V and LDOIN supply is 3.3V, the headphones can each deliver up to 40mW power into a 16Ω load.

The headphone drivers are capable of driving a mixed combination of DAC signal, left and right ADC PGA signal and line-bypass from analog input IN1_L and IN1_R by configuring Page 1, Register 12 and Page 1, Register 13 respectively. The ADC PGA signals can be attenuated up to 30dB before routing to headphone drivers by configuring Page 1, Register 24 and Page 1, Register 25. The analog line-input signals can be attenuated up to 72dB before routing by configuring Page 1, Register 22 and 23. The level of the DAC signal can be controlled using the digital volume control of the DAC in Page 0, Reg 65 and 66. To control the output-voltage swing of headphone drivers, the digital volume control provides a range of –6.0dB to +29.0dB (1) in steps of 1dB. These can be configured by programming Page 1, Register 16 and 17. These level controls are not meant to be used as dynamic volume control, but to set output levels during initial device configuration. Refer to for recommendations for using headphone volume control for achieving 0dB gain through the DAC channel with various configurations.

1. If the device must be placed into 'mute' from the –6.0dB setting, set the device at a gain of –5.0dB first, then place the device into mute.