9.1 Layout Guidelines
PCB design is made considering the application and the review is specific for each system requirements. However, general considerations can optimize the system performance.
- The TLV320DAC3100 thermal pad must be connected to analog output driver ground using multiple VIAS to minimize impedance between the device and ground.
- Analog and digital grounds must be separated to prevent possible digital noise form affecting the analog performance of the board.
- The TLV320DAC3100 requires the decoupling capacitors to be placed as close as possible to the device power supply terminals.