SLVSB71E February   2012  – September 2016 TLV62150 , TLV62150A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable / Shutdown (EN)
      2. 8.3.2 Soft Start / Tracking (SS/TR)
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Pin-Selectable Output Voltage (DEF)
      5. 8.3.5 Frequency Selection (FSW)
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Output Voltage
        2. 9.2.2.2 External Component Selection
          1. 9.2.2.2.1 Inductor Selection
          2. 9.2.2.2.2 Capacitor Selection
            1. 9.2.2.2.2.1 Output Capacitor
            2. 9.2.2.2.2.2 Input Capacitor
            3. 9.2.2.2.2.3 Soft-Start Capacitor
        3. 9.2.2.3 Tracking Function
        4. 9.2.2.4 Output Filter and Loop Stability
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 LED Power Supply
      2. 9.3.2 Active Output Discharge
      3. 9.3.3 Inverting Power Supply
      4. 9.3.4 Various Output Voltages
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

The component selection used for measurements is given as follows:

Table 3. List of Components

REFERENCE DESCRIPTION MANUFACTURER(1)
IC 17-V, 1-A Step-Down Converter, VQFN TLV62150RGT, Texas Instruments
L1 2.2 µH, 0.165 × 0.165 in XFL4020-222MEB, Coilcraft
C1 10 µF, 25 V, Ceramic Standard
C3 22 µF, 6.3 V, Ceramic Standard
C5 3300 pF, 25 V, Ceramic
R1 depending on Vout
R2 depending on Vout
R3 100 kΩ, Chip, 0603, 1/16 W, 1% Standard
(1) See Third-Party Products Disclaimer