SBAS933B November   2019  – March 2021 TMAG5110 , TMAG5111

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 2D Description
        1. 8.3.1.1 2D General Description and Advantages
        2. 8.3.1.2 2D Magnetic Sensor Response
        3. 8.3.1.3 Axis Polarities
      2. 8.3.2 Axis Options
        1. 8.3.2.1 Device Placed In-Plane to Magnet
        2. 8.3.2.2 Device Placed on the Side Edge of the Magnet
      3. 8.3.3 Power-On Time
      4. 8.3.4 Propagation Delay
      5. 8.3.5 Hall Element Location
      6. 8.3.6 Power Derating
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Incremental Rotary Encoding Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power-On Time

Figure 8-18 shows the behavior of the device after the VCC voltage is applied and when the field is below the BOP threshold. Once the minimum value for VCC is reached, the TMAG5110 will take time tON to power up and then time tPD to update the output to a level High.

Figure 8-19 shows the behavior of the device after the VCC voltage is applied and when the field is above the BOP threshold. Once the minimum value for VCC is reached, the TMAG5110 will take time tON to power up and then time tPD to update the output to a level High

For the TMAG5111 the power-on behavior is similar but OUT1 will be updated to Low during the tPD time. OUT2 will be updated to High during the tPD time. The output value following the power-on sequence will then depend on the magnet placement, the sense of rotation and the device variant.

GUID-20201013-CA0I-XQBV-WC4V-QMFLLVB4G2S6-low.gif Figure 8-18 Power-On Time When B<BOP
GUID-20201013-CA0I-BBHT-Q3JT-9F6VXBR6HSC1-low.gif Figure 8-19 Power-On Time When B>BOP