SBAS933B November   2019  – March 2021 TMAG5110 , TMAG5111

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 2D Description
        1. 8.3.1.1 2D General Description and Advantages
        2. 8.3.1.2 2D Magnetic Sensor Response
        3. 8.3.1.3 Axis Polarities
      2. 8.3.2 Axis Options
        1. 8.3.2.1 Device Placed In-Plane to Magnet
        2. 8.3.2.2 Device Placed on the Side Edge of the Magnet
      3. 8.3.3 Power-On Time
      4. 8.3.4 Propagation Delay
      5. 8.3.5 Hall Element Location
      6. 8.3.6 Power Derating
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Incremental Rotary Encoding Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Derating

The device is specified from –40 °C to 125 °C for a voltage rating of 2.5 V to 38 V. Because the part is draining at its maximum a current of 17 mA the maximum voltage that can be applied will depend on what is the maximum ambient temperature acceptable for the application. The curve in Figure 8-23 shows the maximum acceptable power supply voltage versus the maximum acceptable ambient temperature.

The Figure 8-23 can also be calculated using the following formulas:

Equation 1. GUID-BDF79CC5-B085-47FB-99FA-AB53C630D876-low.gif

where

  • TJ is the junction temperature
  • TA is the ambient temperature
  • ΔT is the difference between the junction temperature and the ambient temperature
Equation 2. GUID-1238350B-EBF1-4F5F-8028-D11AED928C60-low.gif

where

  • PD is the power dissipated by the part
  • RθJA is the junction to ambiant thermal resistance
Equation 3. GUID-705B229F-C23F-4ABA-8250-F81992409A88-low.gif

where

  • VCC is the voltage supply of the device
  • ICC is the current consumption of the device

Combining the three equations above gives Equation 4 below:

Equation 4. GUID-C4D4FEE9-1E72-46FF-9DA6-083A92823B43-low.gif

This equation gives the maximum voltage the part can handle in regards of the ambient temperature.

For example, in the application required to work within a ambient temperature of maximum 85 °C, with TJmax, RθJA and ICCmax are defined in the data sheet, the maximum voltage allowed for this application is determined in Equation 5:

Equation 5. GUID-D242F225-482D-4C60-9830-667B79F41D8A-low.gif
GUID-9FE0ACE7-D1BB-4A2C-90E7-C8709F020057-low.gifFigure 8-23 Power Derating Curve