SBOSAF3C November   2023  – June 2025 TMCS1126

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Typical Characteristics
      1. 6.10.1 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error and Offset Error Drift
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Input Isolation
      3. 8.3.3 Ambient Field Rejection
      4. 8.3.4 High-Precision Signal Chain
        1. 8.3.4.1 Temperature Stability
        2. 8.3.4.2 Lifetime and Environmental Stability
      5. 8.3.5 Internal Reference Voltage
      6. 8.3.6 Current-Sensing Measurable Ranges
      7. 8.3.7 Overcurrent Detection
        1. 8.3.7.1 Setting The User Configurable Overcurrent Threshold
          1. 8.3.7.1.1 Setting Overcurrent Threshold Using Power Supply Voltage
          2. 8.3.7.1.2 Setting Overcurrent Threshold Using Internal Reference Voltage
          3. 8.3.7.1.3 Setting Overcurrent Threshold Example
        2. 8.3.7.2 Overcurrent Output Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Total Error Calculation Examples
        1. 9.1.1.1 Room-Temperature Error Calculations
        2. 9.1.1.2 Full-Temperature Range Error Calculations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Device Support
      1. 10.2.1 Development Support
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DVG Package10-Pin SOICTop View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 IN+ Analog Input Input current positive pin
2 IN– Analog Input Input current negative pin
3 OC Digital Output Overcurrent output, open-drain active low. Connect pin to GND if not used.
4 VS Analog Power supply
5 VOC Analog Input Overcurrent threshold. Sets overcurrent threshold. Connect pin to VS if not used.
6 VOUT Analog Output Output voltage
7 VREF Analog Output Zero current output voltage reference
8 NC - Reserved. Pin can be connected to GND or left floating.
9 GND Analog Ground
10 NC - Reserved. Pin can be connected to GND or left floating.