SBOS702D October   2014  – December 2018 TMP102-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Digital Temperature Output
      2. 7.3.2  Serial Interface
      3. 7.3.3  Bus Overview
      4. 7.3.4  Serial Bus Address
      5. 7.3.5  Writing and Reading Operation
      6. 7.3.6  Slave Mode Operations
        1. 7.3.6.1 Slave Receiver Mode
        2. 7.3.6.2 Slave Transmitter Mode
      7. 7.3.7  SMBus Alert Function
      8. 7.3.8  General Call
      9. 7.3.9  High-Speed (Hs) Mode
      10. 7.3.10 Time-Out Function
      11. 7.3.11 Timing Diagrams
      12. 7.3.12 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1 and F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL Bit)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High-Limit and Low-Limit Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The TMP102-Q1 device is a digital temperature sensor that is optimal for thermal-management and thermal- protection applications. The TMP102-Q1 device is two-wire, SMBus, and I2C interface-compatible. The device is specified over an operating temperature range of –40°C to 125°C. Figure 7 shows a block diagram of the TMP102-Q1 device.

The temperature sensor in the TMP102-Q1 device is the chip itself. Thermal paths run through the package leads as well as the plastic package. The package leads provide the primary thermal path because of the lower thermal resistance of the metal.

An alternative version of the TMP102-Q1 device is available. The TMP112-Q1 device has highest accuracy, the same micro-package, and is pin-to-pin compatible.

Table 1. Advantages of TMP112-Q1 Versus TMP102-Q1

DEVICE COMPATIBLE INTERFACES PACKAGE SUPPLY CURRENT SUPPLY VOLTAGE (MIN) SUPPLY VOLTAGE (MAX) RESOLUTION LOCAL SENSOR ACCURACY (MAX) SPECIFIED CALIBRATION DRIFT SLOPE
TMP112-Q1 I2C
SMBus
SOT563
1.2 × 1.6 × 0.6
10 µA 1.4 V 3.6 V 12 bit
0.0625°C
0.5°C: (0°C to 65°C)
1°C: (-40°C to 125°C)
Yes
TMP102-Q1 I2C
SMBus
SOT563
1.2 × 1.6 × 0.6
10 µA 1.4 V 3.6 V 12 bit
0.0625°C
2°C: (25°C to 85°C)
3°C: (-40°C to 125°C)
No