SBOS564B November   2011  – December 2018 TMP104

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Typical Application
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Timeout Function
      2. 7.2.2 Noise
      3. 7.2.3 SMAART Wire™ Interface Timing Specifications
    3. 7.3 Programming
      1. 7.3.1 Communication Protocol
      2. 7.3.2 Command Register
      3. 7.3.3 Global Initialization and Address Assignment Sequence
      4. 7.3.4 Global Read and Write
      5. 7.3.5 Global Clear Interrupt
      6. 7.3.6 Global Software Reset
      7. 7.3.7 Individual Read and Write
    4. 7.4 Register Maps
      1. 7.4.1 Temperature Register
      2. 7.4.2 Configuration Register
        1. 7.4.2.1 Temperature Watchdog Function (FH, FL)
        2. 7.4.2.2 Conversion Rate (CR1, CR0)
        3. 7.4.2.3 Conversion Modes
          1. 7.4.2.3.1 Shutdown Mode (M1 = 0, M0 = 0)
          2. 7.4.2.3.2 One-Shot Mode (M1 = 0, M0 = 1)
          3. 7.4.2.3.3 Continuous Conversion Mode (M1 = 1)
        4. 7.4.2.4 Interrupt Functionality (INT_EN)
      3. 7.4.3 Temperature Limit Registers
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The TMP104 is a digital output temperature sensor in a wafer chip-scale package (WCSP) that is optimal for thermal management and thermal profiling. The TMP104 includes a SMAART wire interface that is capable of communicating in a daisy-chain with up to 16 devices on a single bus. The interface requires two pins from the host; the first device in the daisy-chain receives data from the host and the last device in the daisy-chain returns data to the host. In addition, the TMP104 has the capability of executing multiple device access (MDA) commands that allow multiple TMP104s to respond to a single global bus command. MDA commands reduce communication time and power in a bus that contains multiple TMP104 devices. The TMP104 is specified over a temperature range of –40ºC to +125ºC.

The TMP104 also has the capability of configuring the bus in a transparent mode, where the input from the host is sent directly to the next device in the chain without delay. Additionally, the TMP104 can disconnect the chain and create a serial communication controlled by each TMP104 on the bus, thereby allowing each device to have configurable addressing and interrupt capabilities. The input pin, RX, is a high-impedance node. The output pin, TX, has an internal push-pull output stage that can drive the host to GND or V+.

After an initialization sequence, each device on the bus is programmed with its own interface address that allows it to respond to its own address and also respond to general commands that permit the user to read or write to all of the devices on the bus without having to send its individual address and command to each individual device.

The temperature sensor in the TMP104 is the chip itself. Thermal paths run through the package bumps as well as the package. The lower thermal resistance of metal causes the bumps to provide the primary thermal path. To maintain accuracy in applications that require air or surface temperature measurement, take care to isolate the package from ambient air temperature. A thermally-conductive adhesive can help to achieve accurate surface temperature measurement.