SBOS441I September   2009  – October 2019 TMP431 , TMP432

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematics
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Beta Compensation
      3. 8.3.3 Series Resistance Cancellation
      4. 8.3.4 Differential Input Capacitance
      5. 8.3.5 Filtering
      6. 8.3.6 Sensor Fault
      7. 8.3.7 THERM and ALERT/THERM2
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
      2. 8.4.2 One-Shot Mode
    5. 8.5 Programming
      1. 8.5.1  Serial Interface
      2. 8.5.2  Bus Overview
      3. 8.5.3  Timing Diagrams
      4. 8.5.4  Serial Bus Address
      5. 8.5.5  Read and Write Operations
      6. 8.5.6  Undervoltage Lockout
      7. 8.5.7  Timeout Function
      8. 8.5.8  High-Speed Mode
      9. 8.5.9  General Call Reset
      10. 8.5.10 SMBus Alert Function
    6. 8.6 Register Maps
      1. 8.6.1  Pointer Register
      2. 8.6.2  Temperature Registers
      3. 8.6.3  Limit Registers
      4. 8.6.4  Status Registers
        1. 8.6.4.1 TMP431 Status Register
        2. 8.6.4.2 TMP432 Status Register
      5. 8.6.5  Configuration Register 1
      6. 8.6.6  Configuration Register 2
      7. 8.6.7  Conversion Rate Register
      8. 8.6.8  Beta Compensation Configuration Register
      9. 8.6.9  η-Factor Correction Register
      10. 8.6.10 Software Reset
      11. 8.6.11 Consecutive Alert Register
      12. 8.6.12 Therm Hysteresis Register
      13. 8.6.13 Identification Registers
      14. 8.6.14 Open Status Register
      15. 8.6.15 Channel Mask Register
      16. 8.6.16 High Limit Status Register
      17. 8.6.17 Low Limit Status Register
      18. 8.6.18 THERM Limit Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (March 2016) to I Revision

  • Added acknowledgement information to the SMBus Alert Function section Go
  • Added register comparison information to the Limit Registers sectionGo
  • Removed sentence from the TMP432 Status Register section: Clearing the Status Register bits does not clear the state of the ALERT pin; an SMBus alert response address command must be used to clear the ALERT pin. Go
  • Added new ALERT pin information to the Configuration Register 1 sectionGo
  • Changed extended measurement range from: (–55°C to 150°C) to: (–64°C to 191°C) Go
  • Added Conversion Rate Timing Diagram Go
  • Split the η table column into η = 1.008 and η = 1.000 in the η-Factor Range tableGo

Changes from G Revision (December 2015) to H Revision

  • Changed row 1B in Table 4Go
  • Changed 7th paragraph of TMP432 Status Register section Go
  • Changed Open Status Register sectionGo
  • Added last sentence to High Limit Status Register sectionGo
  • Added last sentence to Low Limit Status Register section Go

Changes from F Revision (August 2013) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed the Timing Requirements table with new I2C data. Updated affected values throughout the data sheet Go

Changes from E Revision (December 2012) to F Revision

  • Added five new register descriptionsGo

Changes from D Revision (November 2012) to E Revision

  • Changed all MSOP-10 to VSSOP-10 throughout documentGo

Changes from C Revision (February 2011) to D Revision

  • Changed all MSOP-8 to VSSOP-8 throughout documentGo

Changes from B Revision (April 2010) to C Revision

Changes from A Revision (November 2009) to B Revision

Changes from * Revision (September 2009) to A Revision

  • Changed device status for TMP432 throughout documentGo
  • Corrected bit D6 value in Configuration Register 1 in TMP431 Register MapGo