SNIS211D October   2019  – November 2020 TMP63

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TMP63 R-T table
      2. 8.3.2 Linear Resistance Curve
      3. 8.3.3 Positive Temperature Coefficient (PTC)
      4. 8.3.4 Built-In Fail Safe
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Thermistor Biasing Circuits
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Thermal Protection With Comparator
          2. 9.2.1.2.2 Thermal Foldback
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (June 2020) to Revision D (November 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed preview note for DYA packageGo
  • Updated Device Comparison table with 150 °C rating for DYA packagesGo
  • Increased maximum junction temperature from 150 to 155 in Absolute Maximum Ratings TableGo
  • Increased maximum storage temperature from 150 to 155 in Absolute Maximum Ratings TableGo
  • Added DYA TA support to Recommended Operating Conditions TableGo
  • Added 1000 hour Long Term Drift specification for DYA packageGo
  • Changed the Typical Characteristics sectionGo
  • Added Built-In Fail Safe sectionGo

Changes from Revision B (February 2020) to Revision C (May 2020)

  • Updated Device Comparison tableGo
  • Corrected view description in Pin Configuration and FunctionsGo
  • Changed Maximum ISNS from 400 µA to 40 µA in Recommended Operating Conditions TableGo

Changes from Revision * (December 2019) to Revision B (February 2020)

  • Updated TitleGo
  • Updated features listGo
  • Updated DescriptionGo
  • Added DYA package as preview informationGo
  • Added DYA package to Thermal Information TableGo
  • Changed minimum spec for 'Long Term Drift' for RH = 85 % from 0.1 % to -1 %Go
  • Added typical spec for 'Long Term Drift' for RH = 85 %Go
  • Changed maximum spec for 'Long Term Drift' for RH = 85 % from 0.8 % to 1 %Go
  • Changed minimum spec for 'Long Term Drift' from 0.1 % to -1.5 %Go
  • Added typical spec for 'Long Term Drift'Go
  • Changed maximum spec for 'Long Term Drift' from 1 % to 1.8 %Go
  • Updated Thermistor Design Tool linkGo

Changes from Revision * (October 2019) to Revision A (December 2019)

  • Changed device status from Advanced Information to Production DataGo