SBOS583B December 2011 – December 2016 TMP709
The TMP709 is extremely simple to lay out. Figure 7 shows the recommended board layout.
The TMP709 quiescent current is typically 40 μA. The device dissipates negligible power when the output drives a high-impedance load. Thus, the die temperature is the same as the package temperature. In order to maintain accurate temperature monitoring, provide a good thermal contact between the TMP709 package and the device being monitored. The rise in die temperature as a result of self-heating is given by Equation 2:
To limit the effects of self-heating, keep the output current at a minimum level.