SLDS151A May   2009  – June 2015 TMP814

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Speed Control
      2. 7.3.2 Constant Voltage Bias
      3. 7.3.3 Soft-Start
      4. 7.3.4 Lock Detection
      5. 7.3.5 Current Limit
      6. 7.3.6 Minimum Speed Setting
      7. 7.3.7 Speed Output
      8. 7.3.8 Drive Frequency Selection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 12-V Sample Application Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 24-V/48-V Sample Application Circuit
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 18 V
VOUT Output voltage OUT1P, OUT1N, OUT2P, OUT2N 18 V
IOUT Continuous output current OUT1P, OUT1N, OUT2P, OUT2N 50 mA
IHB Continuous output current HB 10 mA
VTH Input voltage VTH 8 V
VRD
VFG		 Output voltage RD, FG 18 V
IRD
IFG		 Continuous output current RD, FG 10 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

TA = 25°C
MIN MAX UNIT
VCC Supply voltage 6 16 V
VTH VTH input voltage Full-speed mode 0 7 V
VICM Hall input common phase input voltage 0.2 3 V
TA Operating free-air temperature –30 95 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP814 UNIT
PW (TSSOP)
20 PINS
RθJA Junction-to-ambient thermal resistance 83 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.6 °C/W
RθJB Junction-to-board thermal resistance 42.1 °C/W
ψJT Junction-to-top characterization parameter 24.3 °C/W
ψJB Junction-to-board characterization parameter 0.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 41.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VCC = 12 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V6VREG Output voltage 6VREG IHB = 5 mA 5.8 6 6.15 V
VVOVER Output voltage VOVER 12 12.8 13.6 V
VCRH High-level output voltage CPWM 4.35 4.55 4.75 V
VCRL Low-level output voltage 1.45 1.65 1.85 V
fPWM Oscillation frequency CP = 100 pF 18 25 32 kHz
VCTH High-level output voltage CT 3.4 3.6 3.8 V
VCTL Low-level output voltage 1.4 1.6 1.8 V
ICT1 Charge current 1.6 2 2.5 μA
ICT2 Discharge current 0.16 0.2 0.28 μA
RCT Charge/discharge current ratio 8 10 12
VON Output voltage OUT_N IO = 20 mA 4 10 V
IOP Sink current OUT_P 15 20 mA
VHN Hall input sensitivity H+, H- Zero peak value
(including offset and hysteresis)		 10 20 mV
VRD
VFG		 Low-level output voltage RD, FG IRD = 5 mA or IFG = 5 mA 0.15 0.3 V
IRDL
IFGL		 Output leakage current VRD = 16 V or VFG = 16 V 30 μA
ICC Supply current During drive 4 10 14 mA
During lock protection 4 10 14
TMP814 ai_control_timing_lds151.gif
A. Minimum speed setting (stop) mode
PWM-IN input is filtered to generate the VTH voltage. At low speed, the fan rotates with the minimum speed set with RMI during low speed. If the minimum speed is not set (RMI = 6VREG), the fan stops.
B. Low ↔ high speed mode
PWM control is made through comparison of oscillation and VTH voltages with CPWM changing between 1.6 V ↔ 4.6 V.
Upper and lower TRs are turned ON when the VTH voltage is greater. The upper output TR is turned OFF when the VTH voltage is lower, and the coil current is regenerated in the lower TR. Therefore, as the VTH voltage lowers, the output ON duty increases, increasing the coil current and raising the motor speed. The rotation speed is fed back by the FG output.
C. Full speed mode
The full-speed mode becomes effective with the VTH voltage of 1.65 V or less. (VTH must be equal to GND when the speed control is not used.)
D. PWM-IN input disconnection mode
When the PWM-IN input pin is disconnected, VTH becomes 1.65 V or less and the output enables full drive at 100%. The fan runs at full speed (see Figure 3).
Figure 1. Control Timing

6.6 Typical Characteristics

TMP814 D001_SLDS151.gif
Figure 2. 6VREGOUT Load Regulation