SBOSA26A December 2020 – February 2021 TMP9A00-EP
PRODUCTION DATA
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Introduction to Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.6 Typical Characteristics
Figure 6-1 Output Impedance vs Temperature
Figure 6-3 Output Voltage vs Temperature
Figure 6-5 Power-Supply Rejection vs Temperature
Figure 6-7 Temperature Error vs Temperature
Figure 6-9 Wideband Output Noise Voltage
Figure 6-2 Quiescent Current vs Temperature
Figure 6-4 Quiescent Current vs Supply Voltage
Figure 6-6 Power-Supply Rejection vs Temperature
Figure 6-8 Minimum Supply Voltage vs Temperature
Figure 6-10 Thermal Settling (Fluid-Filled Temperature Bath)