SPRS867A Data sheet

SPRS867A February 2013 – August 2016 TMS320DM369

PRODUCTION DATA.

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)

ZCE|338

Thermal pad, mechanical data (Package|Pins)

Orderable Information

sprs867a_oa

3 Device Overview

3.1 Device Comparison

Table 3-1 shows a comparison between devices, highlighting the differences.

Table 3-1 Device Comparison

Features	Devices
Features	TMS320DM365	TMS320DM368	TMS320DM369	DMVA1	DMVA2
ARM MHz	216 MHz (1.2 V) or 270 MHz (1.2 V) 300 MHz (1.35 V)	432 MHz (1.35 V)	432 MHz (1.35 V)	300 MHz (1.35 V)	432 MHz
DDR2 / mDDR	540 MHz / 336 MHz	680 MHz / 336 MHz	680 MHz / 336 MHz	540 MHz / 336 MHz	680 MHz / 336 MHz
Noise Filtering Engine	NONE	NONE	YES	NONE	NONE
Vision Coprocessor	NONE	NONE	NONE	YES	YES

3.2 Device Characteristics

Table 3-2 provides an overview of the DMSoC. The table shows significant features of the device, including the peripherals, capacity of on-chip RAM, ARM operating frequency, the package type with pin count, and so forth.

Table 3-2 Characteristics of the Processor

HARDWARE FEATURES		DEVICE
Peripherals Not all peripherals pins are available at the same time (For more detail, see Section 4).	DDR2 / mDDR Memory Controller	DDR2 / mDDR (16-bit bus width)
	Asynchronous EMIF (AEMIF)	Asynchronous (8/16-bit bus width) RAM, Flash (NOR, NAND, OneNAND)
	Flash Card Interfaces	Two MMC/SD One SmartMedia/xD
	EDMA	64 independent DMA channels Eight QDMA channels
	Timers	Four 64-Bit General Purpose (each configurable as two separate 32-bit timers) One 64-Bit Watch Dog
	UART	Two (one with RTS and CTS flow control)
	SPI	Five (each supports two slave devices)
	I²C	One (Master/Slave)
	10/100 Ethernet MAC with Management Data I/O	One
	multichannel Buffered Serial Port [McBSP]	One McBSP
	Power Management and Real Time Clock Subsystem (PRTCSS)	RTC (32.768kHz), GPIO
	Key Scan	4 x 4 Matrix, 5 x 3 Matrix
	Voice Codec	One
	Analog-to-Digital Converter (ADC)	6-channel, 10-bit Interface
	General-Purpose Input/Output Port	Up to 104
	Pulse width modulator (PWM)	Four outputs
	Configurable Video Ports	One Input (VPFE) One Output (VPBE)
	USB 2.0	High Speed Device High Speed Host On The Go (HS-USB-OTG)
	USB 2.0	High Speed Device High Speed Host On The Go (HS-USB-OTG)
	Wireless Interfaces	Through SDIO
	RTO	Four Channels
On-Chip CPU Memory	Organization	ARM 16-KB I-cache, 8-KB D-cache, 32-KB RAM, 16-KB ROM
JTAG BSDL_ID	JTAGID register (address location: 0x01C4 0028)	See Section 7.27.1, JTAG Register Description
CPU Frequency (Maximum)	MHz	ARM: 432-MHz
Voltage	Core (V)	1.35 V
Voltage	I/O (V)	3.3 V, 1.8 V
PLL Options	Reference frequency options Configurable PLL controller	19.2 MHz, 24 MHz, 27 MHz, 36 MHz PLL bypass, programmable PLL
BGA Package	13 x 13 mm	338-Pin BGA (ZCE)
Process Technology		65 nm
Product Status⁽¹⁾	Product Preview (PP), Advance Information (AI), or Production Data (PD)	PD

(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

3.3 Device Compatibility

The ARM926EJ-S RISC CPU is compatible with other ARM9 CPUs from ARM Holdings plc.

3.4 ARM Subsystem Overview

The ARM Subsystem contains components required to provide the ARM926EJ-S (ARM) master control of the overall device system, including the components of the ARM Subsystem, the peripherals, and the external memories.

The ARM is responsible for handling system functions such as system-level initialization, configuration, user interface, user command execution, connectivity functions, interface and control of the subsystem, etc. The ARM is master and performs these functions because it has a large program memory space and fast context switching capability, and is thus suitable for complex, multi-tasking, and general-purpose control tasks.

3.4.1 Components of the ARM Subsystem

The ARM Subsystem consists of the following components:

ARM926EJ-S RISC processor, including:
- coprocessor 15 (CP15)
- MMU
- 16KB Instruction cache
- 8KB Data cache
- Write Buffer
- Java accelerator
ARM Internal Memories
- 32KB Internal RAM (32-bit-wide access)
- 16KB Internal ROM (ARM bootloader for non-AEMIF boot modes)
Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)
System Control Peripherals
- ARM Interrupt Controller
- PLL Controller
- Power and Sleep Controller
- System Control Module

The ARM also manages/controls all the device peripherals.

Figure 3-1 shows the functional block diagram of the ARM Subsystem.

Figure 3-1 ARM Subsystem Block Diagram

3.4.2 ARM926EJ-S RISC CPU

The ARM Subsystem integrates the ARM926EJ-S processor. The ARM926EJ-S processor is a member of ARM9 family of general-purpose microprocessors. This processor is targeted at multi-tasking applications where full memory management, high performance, low die size, and low power are all important. The ARM926EJ-S processor supports the 32-bit ARM and 16 bit THUMB instruction sets, enabling the user to trade off between high performance and high code density. Specifically, the ARM926EJ-S processor supports the ARMv5TEJ instruction set, which includes features for efficient execution of Java byte codes, providing Java performance similar to Just in Time (JIT) Java interpreter, but without associated code overhead.

The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both hardware and software debug. The ARM926EJ-S processor has a Harvard architecture and provides a complete high performance subsystem, including:

ARM926EJ -S integer core
CP15 system control coprocessor
Memory Management Unit (MMU)
Separate instruction and data Caches
Write buffer
Separate instruction and data Tightly-Coupled Memories (TCMs) [internal RAM] interfaces
Separate instruction and data AHB bus interfaces
Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)

For more complete details on the ARM9, see the ARM926EJ-S Technical Reference Manual, available at www.arm.com.

3.4.3 CP15

The ARM926EJ-S system control coprocessor (CP15) is used to configure and control instruction and data caches, Tightly-Coupled Memories (TCMs), Memory Management Unit (MMU), and other ARM subsystem functions. The CP15 registers are programmed using the MRC and MCR ARM instructions, when the ARM in a privileged mode such as supervisor or system mode.

3.4.4 MMU

The ARM926EJ-S MMU provides virtual memory features required by operating systems such as Linux, WindowCE, ultron, ThreadX, etc. A single set of two level page tables stored in main memory is used to control the address translation, permission checks and memory region attributes for both data and instruction accesses. The MMU uses a single unified Translation Lookaside Buffer (TLB) to cache the information held in the page tables. The MMU features are:

Standard ARM architecture v4 and v5 MMU mapping sizes, domains and access protection scheme.
Mapping sizes are:
- 1MB (sections)
- 64KB (large pages)
- 4KB (small pages)
- 1KB (tiny pages)
Access permissions for large pages and small pages can be specified separately for each quarter of the page (subpage permissions)
Hardware page table walks
Invalidate entire TLB, using CP15 register 8
Invalidate TLB entry, selected by MVA, using CP15 register 8
Lockdown of TLB entries, using CP15 register 10

3.4.5 Caches and Write Buffer

The size of the Instruction Cache is 16KB, Data cache is 8KB. Additionally, the Caches have the following features:

Virtual index, virtual tag, and addressed using the Modified Virtual Address (MVA)
Four-way set associative, with a cache line length of eight words per line (32-bytes per line) and with two dirty bits in the Dcache
Dcache supports write-through and write-back (or copy back) cache operation, selected by memory region using the C and B bits in the MMU translation tables.
Critical-word first cache refilling
Cache lockdown registers enable control over which cache ways are used for allocation on a line fill, providing a mechanism for both lockdown, and controlling cache corruption
Dcache stores the Physical Address TAG (PA TAG) corresponding to each Dcache entry in the TAG RAM for use during the cache line write-backs, in addition to the Virtual Address TAG stored in the TAG RAM. This means that the MMU is not involved in Dcache write-back operations, removing the possibility of TLB misses related to the write-back address.
Cache maintenance operations provide efficient invalidation of, the entire Dcache or Icache, regions of the Dcache or Icache, and regions of virtual memory.

The write buffer is used for all writes to a noncachable bufferable region, write-through region and write misses to a write-back region. A separate buffer is incorporated in the Dcache for holding write-back for cache line evictions or cleaning of dirty cache lines. The main write buffer has 16-word data buffer and a four-address buffer. The Dcache write-back has eight data word entries and a single address entry.

3.4.6 Tightly Coupled Memory (TCM)

ARM internal RAM is provided for storing real-time and performance-critical code/data and the Interrupt Vector table. ARM internal ROM boot modes include NAND, MMC/SD, UART, USB, SPI, EMAC, and HPI. The RAM and ROM memories interfaced to the ARM926EJ-S via the tightly coupled memory interface that provides for separate instruction and data bus connections. Since the ARM TCM does not allow instructions on the D-TCM bus or data on the I-TCM bus, an arbiter is included so that both data and instructions can be stored in the internal RAM/ROM. The arbiter also allows accesses to the RAM/ROM from extra-ARM sources (e.g., EDMA or other masters). The ARM926EJ-S has built-in DMA support for direct accesses to the ARM internal memory from a non-ARM master. Because of the time-critical nature of the TCM link to the ARM internal memory, all accesses from non-ARM devices are treated as DMA transfers.

Instruction and Data accesses are differentiated via accessing different memory map regions, with the instruction region from 0x0000 through 0x7FFF and data from 0x10000 through 0x17FFF. Placing the instruction region at 0x0000 is necessary to allow the ARM Interrupt Vector table to be placed at 0x0000, as required by the ARM architecture. The internal 32-KB RAM is split into two physical banks of 16KB each, which allows simultaneous instruction and data accesses to be accomplished if the code and data are in separate banks.

3.4.7 Advanced High-performance Bus (AHB)

The ARM Subsystem uses the AHB port of the ARM926EJ-S to connect the ARM to the configuration bus and the external memories. Arbiters are employed to arbitrate access to the separate D-AHB and I-AHB by the configuration bus and the external memories bus.

3.4.8 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)

To support real-time trace, the ARM926EJ-S processor provides an interface to enable connection of an Embedded Trace Macrocell (ETM). The ARM926ES-J Subsystem also includes the Embedded Trace Buffer (ETB). The ETM consists of two parts:

Trace Port provides real-time trace capability for the ARM9.
Triggering facilities provide trigger resources, which include address and data comparators, counter, and sequencers.

The device trace port is not pinned out and is instead only connected to the Embedded Trace Buffer. The ETB has a 4KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace data.

3.4.9 ARM Memory Mapping

The ARM memory map is shown in Table 3-4 and Table 3-5. This section describes the memories and interfaces within the ARM's memory map.

3.4.9.1 ARM Internal Memories

The ARM has access to the following ARM internal memories:

32KB ARM Internal RAM on TCM interface, logically separated into two 16KB pages to allow simultaneous access on any given cycle if there are separate accesses for code (I-TCM bus) and data (D-TCM) to the different memory regions.
16KB ARM Internal ROM

3.4.9.2 External Memories

The ARM has access to the following External memories:

DDR2/mDDR Synchronous DRAM
Asynchronous EMIF / OneNAND / NOR
NAND Flash
Flash card devices:
- MMC/SD
- xD
- SmartMedia

3.4.10 Peripherals

The ARM has access to all of the peripherals on the device.

3.4.11 ARM Interrupt Controller (AINTC)

The device ARM Interrupt Controller (AINTC) has the following features:

Supports up to 64 interrupt channels (16 external channels)
Interrupt mask for each channel
Each interrupt channel can be mapped to a Fast Interrupt Request (FIQ) or to an Interrupt Request (IRQ) type of interrupt.
Hardware prioritization of simultaneous interrupts
Configurable interrupt priority (2 levels of FIQ and 6 levels of IRQ)
Configurable interrupt entry table (FIQ and IRQ priority table entry) to reduce interrupt processing time

The ARM core supports two interrupt types: FIQ and IRQ. See the ARM926EJ-S Technical Reference Manual for detailed information about the ARM’s FIQ and IRQ interrupts. Each interrupt channel is mappable to an FIQ or to an IRQ type of interrupt, and each channel can be enabled or disabled. The INTC supports user-configurable interrupt-priority and interrupt entry addresses. Entry addresses minimize the time spent jumping to interrupt service routines (ISRs). When an interrupt occurs, the corresponding highest priority ISR’s address is stored in the INTC’s ENTRY register. The IRQ or FIQ interrupt routine can read the ENTRY register and jump to the corresponding ISR directly. Thus, the ARM does not require a software dispatcher to determine the asserted interrupt.

3.5 System Control Module

The system control module is a system-level module containing status and top-level control logic required by the device. The system control module consists of a miscellaneous set of status and control registers, accessible by the ARM and supporting all of the following system features and operations:

Device identification
Device configuration
- Pin multiplexing control
- Device boot configuration status
ARM interrupt and EDMA event multiplexing control
Special peripheral status and control
- Timer64
- USB PHY control
- VPSS clock and video DAC control and status
- DDR VTP control
- Clockout circuitry
- GIO de-bounce control
Power management
- Deep sleep
Bandwidth Management
- Bus master DMA priority control

For more information on the System Control Module, see Section 4, Device Configurations and the TMS320DM36x DMSoC ARM Subsystem User's Guide.

3.6 Power Management

The device is designed for minimal power consumption. There are two components to power consumption: active power and leakage power. Active power is the power consumed to perform work and scales with clock frequency and the amount of computations being performed. Active power can be reduced by controlling the clocks in such a way as to either operate at a clock setting just high enough to complete the required operation in the required time-line or to run at a clock setting until the work is complete and then drastically cut the clocks (e.g. to PLL Bypass mode) until additional work must be performed. Leakage power is due to static current leakage and occurs regardless of the clock rate. Leakage, or standby power, is unavoidable while power is applied and scales roughly with the operating junction temperatures. Leakage power can only be avoided by removing power completely from a device or subsystem. The device includes several power management modes which are briefly described in Table 3-3. See the TMS320DM36x DMSoC ARM Subsystem User's Guide (SPRUFG5) for more information on power management.

Table 3-3 Power Management Conditions

POWER MGMT. APPLICATION SCENARIO	PRTCSS	CORE POWER	OSC. POWER	PLL CNTRLR.	ARM926 CLOCK	GIO, UART, I2C CLOCKS	SPI, PWM, TIMER CLOCKS	OTHER PERIPH. CLOCKS	DDR CLOCK/ MODE	DESCRIPTION
PRTCSS	Active	Off	Off	Off	Off	Off	Off	Off	Off	This condition consumes the lowest possible power, except for the PRTCSS.
Deep Sleep Mode⁽¹⁾	Active	On	Off	Bypass Mode (not Active)	Off	Off	Off	Off	Suspend / "Self-Refresh"	This mode consumes the second lowest possible power, except for PRTCSS and core power, where only the deep sleep circuit is on in this mode.
Standby	Active	On	On	Bypass Mode	Off	On	Off	Off	Suspend / "Self-Refresh"	This condition keeps the minimum possible modules powered-on in order to wake up the device. Clocks are suspended except for GIO (interrupts), UART, and I2C (in slave mode).
Low-power (PLL Bypass Mode)	Active	On	On	Bypass Mode	On	On / Off	On / Off	On / Off	Suspend / "Self-Refresh"	Most clocks are suspended, except for ARM, GIO, UART, SPI, I2C, PWM, and timers. Since ARM will not have access to DDR, its internal Cache will be either frozen or not accessed.
System Running (PLL Mode)	Active	On	On	PLL Mode	On	On / Off	On / Off	On / Off	Nominal Clock / Operation	The device, including system PLLs, are on. This condition conserves the least amount of power.

(1) For more details, see TMS320DM36x DMSoC ARM Subsystem User's Guide (SPRUFG5)

3.7 Memory Map Summary

Table 3-4 shows the memory map address ranges of the device. Table 3-5 depicts the expanded map of the Configuration Space (0x01C0 0000 through 0x01FF FFFF). The device has multiple on-chip memories associated with its processor and various subsystems. To help simplify software development a unified memory map is used where possible to maintain a consistent view of device resources across all bus masters. The bus masters are the ARM, EDMA, EMAC, USB, HPI, MJCP, HDVICP and VPSS. The Master Peripherals are EMAC, USB, and HPI. Please see Section 5, System Interconnect, for more details.

Table 3-4 Memory Map

Start Address	End Address	Size (Bytes)	ARM Mem Map	EDMA Mem Map	Master Periph Mem Map	VPSS Mem Map
0x0000 0000	0x0000 3FFF	16K	ARM RAM0 (Instruction)
0x0000 4000	0x0000 7FFF	16K	ARM RAM1 (Instruction)	Reserved	Reserved
0x0000 8000	0x0000 BFFF	16K	ARM ROM (Instruction)
0x0000 C000	0x0000 FFFF	16K	Reserved
0x0001 0000	0x0001 3FFF	16K	ARM RAM0 (Data)	ARM RAM0	ARM RAM0
0x0001 4000	0x0001 7FFF	16K	ARM RAM1 (Data)	ARM RAM1	ARM RAM1
0x0001 8000	0x0001 BFFF	16K	ARM ROM	ARM ROM	ARM ROM
0x0001 C000	0x000F FFFF	912K	Reserved
0x0010 0000	0x01BB FFFF	26M
0x01BC 0000	0x01BC 0FFF	4K	ARM ETB Mem
0x01BC 1000	0x01BC 17FF	2K	ARM ETB Reg	Reserved
0x01BC 1800	0x01BC 18FF	256	ARM IceCrusher			Reserved
0x01BC 1900	0x01BC FFFF	59136	Reserved
0x01BD 0000	0x01BF FFFF	192K
0x01C0 0000	0x01FF FFFF	4M	CFG Bus Peripherals	CFG Bus Peripherals	CFG Bus Peripherals
0x0200 0000	0x09FF FFFF	128M	ASYNC EMIF (Data)	ASYNC EMIF (Data)
0x0A00 0000	0x11EF FFFF	127M - 16K	Reserved	Reserved
0x11F0 0000	0x11F1 FFFF	128K	MJCP DMA Port	MJCP DMA Port
0x11F2 0000	0x11FF FFFF	896K	Reserved	Reserved
0x1200 0000	0x1207 FFFF	512K	HDVICP DMA Port1	HDVICP DMA Port1		HDVICP DMA Port1
0x1208 0000	0x120F FFFF	512K	Reserved	HDVICP DMA Port2	Reserved
0x1210 0000	0x1217 FFFF	512K		HDVICP DMA Port3
0x1218 0000	0x1FFF FFFF	222.5M		Reserved
0x2000 0000	0x2000 7FFF	32K	DDR EMIF Control Regs	DDR EMIF Control Regs
0x2000 8000	0x41FF FFFF	544M-32K
0x4200 0000	0x49FF FFFF	128M	Reserved	Reserved
0x4A00 0000	0x7FFF FFFF	864M
0x8000 0000	0x8FFF FFFF	256M	DDR EMIF	DDR EMIF	DDR EMIF	DDR EMIF
0x9000 0000	0xFFFF FFFF	1792M	Reserved	Reserved	Reserved	Reserved

Table 3-5 ARM Configuration Bus Access to Peripherals

	Address
Region	Start	End	Size
EDMA CC	0x01C0 0000	0x01C0 FFFF	64K
EDMA TC0	0x01C1 0000	0x01C1 03FF	1K
EDMA TC1	0x01C1 0400	0x01C1 07FF	1K
EDMA TC2	0x01C1 0800	0x01C1 0BFF	1K
EDMA TC3	0x01C1 0C00	0x01C1 0FFF	1K
Reserved	0x01C1 1000	0x01C1 FFFF	60 K
UART0	0x01C2 0000	0x01C2 03FF	1K
Reserved	0x01C2 0400	0x01 20 7FFF	1K
Timer 3	0x01C2 0800	0x01C2 0BFF	1K
Real-time out	0x01C2 0C00	0x01C2 0FFF	1K
I2C	0x01C2 1000	0x01C2 13FF	1K
Timer 0	0x01C2 1400	0x01C2 17FF	1K
Timer 1	0x01C2 1800	0x01C2 1BFF	1K
Timer 2	0x01C2 1C00	0x01C2 1FFF	1K
PWM0	0x01C2 2000	0x01C2 23FF	1K
PWM1	0x01C2 2400	0x01C2 27FF	1K
PWM2	0x01C2 2800	0x01C2 2BFF	1K
PWM3	0x01C2 2C00	0x01C2 2FFF	1K
SPI4	0x01C2 3000	0x01C2 37FF	2K
Timer 4	0x01C2 3800	0x01C2 3BFF	1K
ADCIF	0x01C2 3C00	0x01C2 3FFF	1K
Reserved	0x01C2 4000	0x01C3 4FFF	112K
System Module	0x01C4 0000	0x01C4 07FF	2K
PLL Controller 1	0x01C4 0800	0x01C4 0BFF	1K
PLL Controller 2	0x01C4 0C00	0x01C4 0FFF	1K
Power/Sleep Controller	0x01C4 1000	0x01C4 1FFF	4K
Reserved	0x01C4 2000	0x01C4 7FFF	24K
ARM Interrupt Controller	0x01C4 8000	0x01C4 83FF	1K
Reserved	0x01 C4 8400	0x01C63FFF	111K
USB OTG 2.0 Regs / RAM	0x01C6 4000	0x01C6 5FFF	8K
SPI0	0x01C6 6000	0x01C6 67FF	2K
SPI1	0x01C6 6800	0x01C6 6FFF	2K
GPIO	0x01C6 7000	0x01C6 77FF	2K
SPI2	0x01C6 7800	0x01C6 FFFF	2K
SPI3	0x01C6 8000	0x01C6 87FF	2K
Reserved	0x01C6 8800	0x01C6 87FF	2K
PRTCSS Interface Registers	0x01C6 9000	0x01C6 93FF	1K
KEYSCAN	0x01C6 9400	0x01C6 97FF	1K
HPI	0x01C6 9800	0x01C6 9FFF	2K
Reserved	0x01C6 A000	0x01C6 FFFF	24K
VPSS Subsystem
ISP System Configuration Registers	0x01C7 0000	0x01C7 00FF	256
VPBE Clock Control Register	0x01C7 0200	0x01C7 02FF	256
Resizer Registers	0x01C7 0400	0x01C7 07FF	1K
IPIPE Registers	0x01C7 0800	0x01C7 0FFF	2K
ISIF Registers	0x01C7 1000	0x01C7 11FF	512
IPIPEIF Registers	0x01C7 1200	0x01C7 12FF	768
H3A Registers	0x01C7 1400	0x01C7 14FF	256
FDIF Registers	0x01C7 1800	0x01C7 1BFF	1K
OSD Registers	0x01C7 1C00	0x01C7 1CFF	256
Reserved	0x01C7 1D00	0x01C7 1DFF	256
VENC Registers	0x01C7 1E00	0x01C7 1FFF	512
Reserved	0x01C7 2000	0x01CF FFFF	568K
Multimedia / SD 1	0x01D0 0000	0x01D0 1FFF	8K
McBSP	0x01D0 2000	0x01D0 3FFF	8K
Reserved	0x01D0 4000	0x01D0 5FFF	8K
UART1	0x01D0 6000	0x01D0 63FF	1K
Reserved	0x01D0 6400	0x01D0 7FFF	3K
EMAC Control Registers	0x01D0 7000	0x01D0 9FFF	0x01D0 7FFF	4K
EMAC Control Module RAM	0x01D0 8000	8K
EMAC Control Module Registers	0x01D0 A000	0x01D0 AFFF	4K
EMAC MDIO Control Registers	0x01D0 B000	0x01D0 B7FF	2K
Voice Codec	0x01D0 C000	0x01D0 C3FF	1K
Reserved	0x01D0 C400	0x01D0 FFFF	17K
ASYNC EMIF Control	0x01D1 0000	0x01D1 0FFF	4K
Multimedia / SD 0	0x01D1 1000	0x01D1 FFFF	60K
Reserved	0x01D2 0000	0x01D3 FFFF	128K
Reserved	0x01D4 0000	0x01DF FFFF	768K
Reserved	0x01E0 0000	0x01FF FFFF	2M
ASYNC EMIF Data (CE0)	0x0200 0000	0x03FF FFFF	32M
ASYNC EMIF Data (CE1)	0x0400 0000	0x05FF FFFF	32M
Reserved	0x0600 0000	0x09FF FFFF	64M
Reserved	0x0A00 0000	0x0FFF FFFF	96M

3.8 Pin Assignments

Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in the smallest possible package. Pin multiplexing is controlled using a combination of hardware configuration at device reset and software programmable register settings.

3.8.1 Pin Map (Bottom View)

Figure 3-2 through Figure 3-5 show the pin assignments in four quadrants (A, B, C, and D).

1. N.B stands for No-Ball.

Figure 3-2 ZCE Pin Map [Quadrant A]1

1. N.B stands for No-Ball.

Figure 3-3 ZCE Pin Map [Quadrant B]1

1. N.B stands for No-Ball.

Figure 3-4 ZCE Pin Map [Quadrant C]1

1. N.B stands for No-Ball.

Figure 3-5 ZCE Pin Map [Quadrant D]1

3.9 Terminal Functions

Table 3-6 provides a complete pin description list which shows external signal names, the associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin has any internal pullup or pulldown resistors, and a functional pin description. For more detailed information on device configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see Section 4, Device Configurations.

Table 3-6 Pin Descriptions

Name	BGA ID	Type ⁽¹⁾	Group	Power Supply⁽²⁾	IPU IPD⁽³⁾	Reset State	Description⁽⁴⁾
CIN7⁽⁵⁾	A15	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[7]
							YCC 16-bit: time multiplexed between chroma: CB/CR[07]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07]
CIN6⁽⁵⁾	C15	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[6]
							YCC 16-bit: time multiplexed between chroma: CB/CR[06]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[06]
CIN5⁽⁵⁾	B16	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[5]
							YCC 16-bit: time multiplexed between chroma: CB/CR[05]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[05]


CIN4⁽⁵⁾	A16	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[4]
							YCC 16-bit: time multiplexed between chroma: CB/CR[04]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[04]


CIN3 ⁽⁵⁾	A17	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[3]
							YCC 16-bit: time multiplexed between chroma: CB/CR[03]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[03]

CIN2⁽⁵⁾	C16	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[2]
							YCC 16-bit: time multiplexed between chroma: CB/CR[02]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[02]
CIN1⁽⁵⁾	A18	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[1]
							YCC 16-bit: time multiplexed between chroma: CB/CR[01]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[01]

CIN0⁽⁵⁾	B17	I/O	ISIF	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[0]
							YCC 16-bit: time multiplexed between chroma: CB/CR[00]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[00]

YIN7⁽⁵⁾ / GIO103 /SPI3_SCLK	C12	I/O	ISIF/ GIO / SPI3	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[15]
							YCC 16-bit: time multiplexed between luma: Y[07]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[07]
							GIO: GIO[103]
							SPI3: Clock
YIN6⁽⁵⁾ / GIO102 /SPI3_SIMO	A13	I/O	ISIF / GIO / SPI3	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[14]
							YCC 16-bit: time multiplexed between luma: Y[06]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[06]
							GIO: GIO[102]
							SPI3: Slave Input Master Output Data Signal
YIN5⁽⁵⁾ / GIO101 /SPI3_SCS[0]	B13	I/O	ISIF / GIO / SPI3	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[13]
							YCC 16-bit: time multiplexed between luma: Y[05]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[05]
							GIO: GIO[101]
							SPI3: Chip Select 0
YIN4⁽⁵⁾ / GIO100 / SPI3_SOMI / SPI3_SCS[1]	D12	I/O	ISIF / GIO / SPI3	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[12]
							YCC 16-bit: time multiplexed between luma: Y[04]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[04]
							GIO: GIO[100]
							SPI3: Slave Output Master Input Data Signal
							SPI3: Chip Select 1
YIN3⁽⁵⁾ / GIO99	A14	I/O	ISIF / GIO	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[11]
							YCC 16-bit: time multiplexed between luma: Y[03]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[03]
							GIO: GIO[99]
YIN2⁽⁵⁾ / GIO98	B15	I/O	ISIF / GIO	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[10]
							YCC 16-bit: time multiplexed between luma: Y[02]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[02]
							GIO: GIO[98]
YIN1⁽⁵⁾ / GIO97	D14	I/O	ISIF / GIO	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[09]
							YCC 16-bit: time multiplexed between luma: Y[01]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[01]
							GIO: GIO[97]
YIN0⁽⁵⁾ / GIO96	D15	I/O	ISIF / GIO	V_{DD_ISIF18_33}	IPD	Input	Standard ISIF Analog Front End (AFE): raw[08]
							YCC 16-bit: time multiplexed between luma: Y[00]
							YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[00]
							GIO: GIO[96]
HD / GIO95	C14	I/O	ISIF / GIO	V_{DD_ISIF18_33}	IPD	Input	Horizontal synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the ISIF when a new line starts.
HD / GIO95							GIO: GIO[95]
VD / GIO94	B14	I/O	ISIF / GIO	V_{DD_ISIF18_33}	IPD	Input	Vertical synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the ISIF when a new frame starts.
VD / GIO94							GIO: GIO[94]
C_WE_FIELD / GIO93 / CLKOUT0 / USBDRVVBUS	E13	I/O	ISIF / GIO / CLKOUT / USB	V_{DD_ISIF18_33}	IPD	Input	Write enable input signal is used by external device (AFE/TG) to gate the DDR output of the ISIF module.
							Alternately, the field identification input signal is used by external device (AFE/TG) to indicate the which of two frames is input to the ISIF module for sensors with interlaced output. ISIF handles 1- or 2-field sensors in hardware.
							GIO: GIO[93]
							CLKOUT0: Clock Output
							USB: Digital output to control external 5 V supply
PCLK	D13	I/O/Z	ISIF	V_{DD_ISIF18_33}	IPD	Input	Pixel clock input (strobe for lines CI7 through YI0)
YOUT7(R7)⁽⁶⁾	G16	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT6(R6)⁽⁶⁾	G19	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT5(R5)⁽⁶⁾	F15	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT4(R4)⁽⁶⁾	F18	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT3(R3)⁽⁶⁾	F16	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT2(G7)⁽⁶⁾	F19	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT1(G6)⁽⁶⁾	F17	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
YOUT0(G5)⁽⁶⁾	E16	I/O	VENC	V_DDS33		Input	Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
HSYNC / GIO84	G15	I/O	VENC / GIO	V_DDS33		Input	Video Encoder: Horizontal Sync⁽⁴⁾
HSYNC / GIO84							GIO: GIO[84]
VSYNC / GIO83	G18	I/O	VENC / GIO	V_DDS33		Input	Video Encoder: Vertical Sync⁽⁴⁾
VSYNC / GIO83							GIO: GIO[83]
LCD_OE / GIO82	C19	I/O	VENC / GIO	V_DDS33		Output	Video Encoder: Data valid duration ⁽⁴⁾
LCD_OE / GIO82							GIO: GIO[82]
GIO80 / EXTCLK / B2 / PWM3	B19	I/O	GIO / VENC / PWM3	V_DDS33	IPD	Input	GIO: GIO[80]
							Video Encoder: External clock Input, used if clock rates > 27 MHz are needed, e.g. 74.25 MHz for HDTV digital output.
							Digital Video Out: B2⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM3: PWM3 Output
VCLK / GIO79	B18	I/O	VENC / GIO	V_DDS33		Input	Video Encoder: Video Output Clock⁽⁴⁾
VCLK / GIO79							GIO: GIO[79]
GIO92 / COUT7(G4)⁽⁶⁾ / PWM0	E18	I/O	GIO / VENC / PWM0	V_DDS33		Input	GIO: GIO[92]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM0: PWM0 Output
GIO91 / COUT6(G3)⁽⁶⁾ / PWM1	E19	I/O	GIO / VENC / PWM1	V_DDS33		Input	GIO: GIO[91]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM1: PWM1 Output
GIO90 / COUT5(G2)⁽⁶⁾ / PWM2 / RTO0	E15	I/O	GIO / VENC /PWM2 / RTO0	V_DDS33		Input	GIO: GIO[90]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM2: PWM2 Output
							RTO0: RTO0 Output
GIO89 / COUT4(B7) ⁽⁶⁾/ PWM2 / RTO1	E17	I/O	GIO / VENC / PWM2 / RTO1	V_DDS33		Input	GIO: GIO[89]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM2: PWM2 Output
							RTO1: RTO1 Output
GIO88 / COUT3(B6) ⁽⁶⁾/ PWM2 / RTO2	D16	I/O	GIO / VENC / PWM2 / RTO2	V_DDS33		Input	GIO: GIO[88]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM2: PWM2 Output
							RTO2: RTO2 Output
GIO87 / COUT2(B5)⁽⁶⁾ / PWM2 / RTO3	D19	I/O	GIO / VENC /PWM2 / RTO3	V_DDS33		Input	GIO: GIO[87]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM2: PWM2 Output
							RTO3: RTO3 Output
GIO86 / COUT1(B4)⁽⁶⁾ / PWM3 / STTRIG	D18	I/O	GIO / VENC / PWM3	V_DDS33		Input	GIO: GIO[86]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM3: PWM3 Output
							STTRIG: Camera FLASH control trigger signal
GIO85 / COUT0(B3) ⁽⁶⁾/ PWM3	D17	I/O	GIO / VENC / PWM3	V_DDS33		Input	GIO: GIO[85]
							Digital Video Out: VENC settings determine function⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							PWM3: PWM3 Output
GIO81(OSCCFG) / LCD_FIELD / R2 / PWM3	C18	I/O	GIO / VENC / PWM3	V_DDS33		Input	GIO: GIO[81] Note: This pin will be used as oscillator configuration (OSCCFG). The GIO81(OSCCFG) state is latched during reset, and it specifies the oscillation frequency range mode of the pin. See Section 4.7.6 for more details.
							Video Encoder: Field identifier for interlaced display formats⁽⁴⁾. For more details, see the DM36x DMSoC Video Processor Back End User's Guide (SPRUFG9).
							Digital Video Out: R2⁽⁴⁾
							PWM3: PWM3 Output
VREF	D11	A I	Video DAC	V_{DDA18_DAC}			Video DAC: Reference voltage for DAC. For more details, see Section 7.12.2.4, DAC and Video Buffer Electrical Data/Timing. Note: If the DAC peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
IREF	A11	A I/O	Video DAC	V_{DDA18_DAC}			Video DAC: Sets reference current for DAC. An external resistor with nominal value, 2400 ohms, is connected between IREF and V_SS. For more details, see Section 7.12.2.4, DAC and Video Buffer Electrical Data/Timing. Note: If the DAC peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
IDACOUT	B11	A I/O	Video DAC	V_{DDA18_DAC}			Video DAC: Current source input from DAC. An external resistor with nominal value, 2100 ohms, is connected between IDACOUT and VFB. For more details, see Section 7.12.2.4, DAC and Video Buffer Electrical Data/Timing. Note: If the DAC peripheral is not used at all in the application, this pin can either be connected to V_SSor be left open.
VFB	B10	A I/O	Video DAC	V_{DDA18_DAC}			Video DAC: Amplifier feedback node. An external resistor with nominal value, 2150 ohms, is connected between VFB and TVOUT. For more details, see Section 7.12.2.4, DAC and Video Buffer Electrical Data/Timing. Note: If the DAC peripheral is not used at all in the application, this pin can either be connected to V_SSor be left open.
TVOUT	A10	A I/O	Video DAC	V_{DDA18_DAC}			Video DAC: DAC1video output. An external resistor with nominal value, 2150 ohms, is connected between TVOUT and VFB. This is the output node that drives the load (75 ohms). For more details, see Section 7.12.2.4, DAC and Video Buffer Electrical Data/Timing. Note: If the DAC peripheral is not used at all in the application, this pin can either be connected to V_SSor be left open.
COMPY	B12	A O	Video DAC	V_{DDA18_DAC}			Video DAC: Analog video signal component output Y Note: If the DAC peripheral is not used at all in the application, this pin can either be connected to V_SSor be left open.
COMPPB	A12	A O	Video DAC	V_{DDA18_DAC}			Video DAC: Analog video signal component output Pb Note: If the DAC peripheral is not used at all in the application, this pin can either be connected to V_SSor be left open.
COMPPR	C11	A O	Video DAC	V_{DDA18_DAC}			Video DAC: Analog video signal component output Pr Note: If the DAC peripheral is not used at all in the application, this pin can either be connected to V_SSor be left open.
V_{DDA18_DAC}	D10	PWR	Video DAC	V_{DDA18_DAC}			Video DAC: Analog 1.8-V power Note: If the DAC peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{DDA12_DAC}	E12	PWR	Video Dac	V_{DDA12_DAC}			Video DAC: Analog 1.2-V power Note: If the DAC peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{SSA18_DAC}	E11	GND	Video DAC				Video DAC: Analog 1.8-V ground Note: If the DAC peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{SSA12_DAC}	F11	GND	Video DAC				Video DAC: Analog 1.2-V ground Note: If the DAC peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
DDR_CLK	W11	O	DDR	V_{DD18_DDR}			DDR Data Clock
DDR_CLK	W12	O	DDR	V_{DD18_DDR}			DDR Complementary Data Clock
DDR_RAS	U12	O	DDR	V_{DD18_DDR}			DDR Row Address Strobe
DDR_CAS	V12	O	DDR	V_{DD18_DDR}			DDR Column Address Strobe
DDR_WE	W13	O	DDR	V_{DD18_DDR}			DDR Write Enable
DDR_CS	T12	O	DDR	V_{DD18_DDR}			DDR Chip Select
DDR_CKE	R13	O	DDR	V_{DD18_DDR}			DDR Clock Enable
DDR_DQM[1]	W6	O	DDR	V_{DD18_DDR}			Data mask input for DDR_DQ[15:8]
DDR_DQM[0]	T11	O	DDR	V_{DD18_DDR}			Data mask input for DDR_DQ[7:0]
DDR_DQS[1]	T7	I/O	DDR	V_{DD18_DDR}			Data strobe input/outputs for each byte of the 16-bit data bus used to synchronize the data transfers. Output to DDR2 when writing and inputs when reading. They are used to synchronize the data transfers.
DDR_DQS[1]							DDR_DQS1: For DDR_DQ[15:8]
DDR_DQS[0]	T10	I/O	DDR	V_{DD18_DDR}			Data strobe input/outputs for each byte of the 16-bit data bus used to synchronize the data transfers. Output to DDR2 when writing and inputs when reading. They are used to synchronize the data transfers.
DDR_DQS[0]							DDR_DQS0: For DDR_DQ[7:0]
DDR_DQSN[1]	U6	I/O	DDR	V_{DD18_DDR}			DDR: Complimentary data strobe input/outputs for each byte of the 16-bit data bus. They are outputs to the DDR2 when writing and inputs when reading. They are used to synchronize the data transfers.
DDR_DQSN[1]							Note: This signal is used in double ended differential memory interfaces supported by the device.
DDR_DQSN[0]	U9	I/O	DDR	V_{DD18_DDR}			DDR: Complimentary data strobe input/outputs for each byte of the 16-bit data bus. They are outputs to the DDR2 when writing and inputs when reading. They are used to synchronize the data transfers.
DDR_DQSN[0]							Note: This signal is used in double ended differential memory interfaces supported by the device.
DDR_BA[2]	V13	O	DDR	V_{DD18_DDR}			Bank select outputs. Two are required for 1Gb DDR2 memories.
DDR_BA[1]	T13	O	DDR	V_{DD18_DDR}			Bank select outputs. Two are required for 1Gb DDR2 memories.
DDR_BA[0]	W14	O	DDR	V_{DD18_DDR}			Bank select outputs. Two are required for 1Gb DDR2 memories.
DDR_A13	T16	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 13
DDR_A12	V17	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 12
DDR_A11	W18	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 11
DDR_A10	V16	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 10
DDR_A9	U16	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 09
DDR_A8	W17	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 08
DDR_A7	T15	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 07
DDR_A6	W16	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 06
DDR_A5	V15	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 05
DDR_A4	U15	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 04
DDR_A3	T14	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 03
DDR_A2	W15	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 02
DDR_A1	V14	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 01
DDR_A0	U14	O	DDR	V_{DD18_DDR}			DDR Address Bus bit 00
DDR_DQ15	V6	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 15
DDR_DQ14	V7	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 14
DDR_DQ13	R7	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 13
DDR_DQ12	W7	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 12
DDR_DQ11	V8	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 11
DDR_DQ10	R8	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 10
DDR_DQ9	U8	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 09
DDR_DQ8	W8	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 08
DDR_DQ7	R9	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 07
DDR_DQ6	W9	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 06
DDR_DQ5	V9	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 05
DDR_DQ4	W10	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 04
DDR_DQ3	V10	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 03
DDR_DQ2	R10	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 02
DDR_DQ1	V11	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 01
DDR_DQ0	U11	I/O	DDR	V_{DD18_DDR}			DDR Data Bus bit 00
DDR_ DQGATE0	T8	O	DDR	V_{DD18_DDR}			DDR: Loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE1 with same constraints as used for DDR clock and data.
DDR_ DQGATE1	T9	I	DDR	V_{DD18_DDR}			DDR: Loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE0 with same constraints as used for DDR clock and data.
DDR_VREF	P11	PWR	DDR	V_{DD18_DDR}			DDR: DDR_VREF is .5* V_{DD18_DDR} = 0.9V for SSTL2 specific reference voltage.
DDR_PADREFP	R11	O	DDR	V_{DD18_DDR}			DDR: External resistor ( 50 ohm to ground)
EM_A13 / GIO78 / BTSEL[2]	V18	I/O/Z	AEMIF / GIO / BTSEL[2]	V_{DD_AEMIF1_18_33}	IPU/IPD disabled by default	Input	Async EMIF: Address Bus bit[13]
							GIO: GIO[78]
							BTSEL[2]: See Section 4.2, Device Boot Modes for system usage of these pins.
EM_A12 / GIO77 / BTSEL[1]	U18	I/O/Z	AEMIF / GIO / BTSEL[1]	V_{DD_AEMIF1_18_33}	IPU/IPD disabled by default	Input	Async EMIF: Address Bus bit[12]
							GIO: GIO[77]
							BTSEL[1]: See Section 4.2, Device Boot Modes for system usage of these pins.
EM_A11 / GIO76 / BTSEL[0]	V19	I/O/Z	AEMIF / GIO / BTSEL[0]	V_{DD_AEMIF1_18_33}	IPU/IPD disabled by default	Input	Async EMIF: Address Bus bit[11]
							GIO: GIO[76]
							BTSEL[0]: See Section 4.2, Device Boot Modes for system usage of these pins.

EM_A10 / GIO75 / AECFG[2]	U19	I/O/Z	AEMIF / GIO / AECFG[2]	V_{DD_AEMIF1_18_33}	IPU/IPD disabled by default	Input	Async EMIF: Address Bus bit[10]
							GIO: GIO[75]
							AECFG[2]: See Section 4.2, Device Boot Modes and Table 4-14, AECFG (Async EMIF Configuration) for system usage of these pins.

EM_A9 / GIO74 / AECFG[1]	T18	I/O/Z	AEMIF / GIO / AECFG[1]	V_{DD_AEMIF1_18_33}	IPU/IPD disabled by default	Input	Async EMIF: Address Bus bit[09]
							GIO: GIO[74]
							AECFG[1]: See Section 4.2, Device Boot Modes and Table 4-14, AECFG (Async EMIF Configuration) for system usage of these pins.

EM_A8 / GIO73 / AECFG[0]	T19	I/O/Z	AEMIF / GIO / AECFG[0]	V_{DD_AEMIF1_18_33}	IPU/IPD disabled by default	Input	Async EMIF: Address Bus bit[08]
							GIO: GIO[73]
							AECFG[0]: See Section 4.2, Device Boot Modes and Table 4-14, AECFG (Async EMIF Configuration) for system usage of these pins.

EM_A7 / GIO72 / KEYA3	T17	I/O/Z	AEMIF / GIO / KEYSCAN	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Address Bus bit[07]
							GIO: GIO[72]
							Keyscan: A3
EM_A6 / GIO71 / KEYA2	R18	I/O/Z	AEMIF / GIO / KEYSCAN	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Address Bus bit[06]
							GIO: GIO[71]
							Keyscan: A2
EM_A5 / GIO70 / KEYA1	R16	I/O/Z	AEMIF / GIO / KEYSCAN	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Address Bus bit[05]
							GIO: GIO[70]
							Keyscan: A1
EM_A4 / GIO69 / KEYA0	R19	I/O/Z	AEMIF / GIO/KEYSCAN	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Address Bus bit[04]
							GIO: GIO[69]
							Keyscan: A0
EM_A3 / GIO68 / KEYB3	R15	I/O/Z	AEMIF / GIO/ KEYSCAN	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Address Bus bit[03]
							GIO: GIO[68]
							Keyscan: B3
EM_A2 / HCNTLA	M18	I/O/Z	AEMIF/HPI	V_{DD_AEMIF2_18_33}		Output	Async EMIF: Address Bus bit[02]
EM_A2 / HCNTLA							HPI: The state of HCNTLA and HCNTLB determines if address, data, or control information is being transmitted between an external host and the device. Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_A1 / HHWIL	M19	I/O/Z	AEMIF/HPI	V_{DD_AEMIF2_18_33}		Output	Async EMIF: Address Bus bit[01]
EM_A1 / HHWIL							HPI: This pin is half-word identification input HHWIL. Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_A0 / GIO67 / KEYB2 / HCNTLB	L17	I/O/Z	AEMIF / GIO / KEYSCAN / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Address Bus bit[00] Note that the EM_A0 is always a 32-bit address
							GIO: GIO[56]
							Keyscan: B2
							HPI: The state of HCNTLA and HCNTLB determines if address, data, or control information is being transmitted between an external host and the device. Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_BA1 / GIO66 / KEYB1 / HINTN	R17	I/O/Z	AEMIF / GIO / KEYSCAN / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Bank Address 1 signal = 16-bit address. In 16-bit mode, lowest address bit. In 8-bit mode, second lowest address bit
							GIO: GIO[66]
							Keyscan: B1
							HPI: This pin is host interrupt output HINT Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_BA0 / EM_A14 / GIO65 / KEYB0	P17	I/O/Z	AEMIF / GIO / KEYSCAN	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Bank Address 0 signal = 8-bit address. In 8-bit mode, lowest address bit.
							Async EMIF: Address line (bit[14] when using 16-bit memories.
							GIO: GIO[65]
							Keyscan: B0
EM_D15 / GIO64 / HD15	P18	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[15]
EM_D15 / GIO64 / HD15							GIO: GIO[64]
							HPI: Data bus bit [15] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D14 / GIO63 / HD14	P16	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[14]
EM_D14 / GIO63 / HD14							GIO: GIO[63]
							HPI: Data bus bit [14] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D13 / GIO62 / HD13	P19	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[13]
							GIO: GIO[62]
							HPI: Data bus bit [13] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D12 / GIO61 / HD12	P15	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[12]
EM_D12 / GIO61 / HD12							GIO: GIO[61]
							HPI: Data bus bit [12] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D11 / GIO60 / HD11	N16	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[11]
EM_D11 / GIO60 / HD11							GIO: GIO[60]
							HPI: Data bus bit [11] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D10 / GIO59 / HD10	N18	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[10]
EM_D10 / GIO59 / HD10							GIO: GIO[59]
							HPI: Data bus bit [10] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D9 / GIO58 / HD9	N19	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[09]
EM_D9 / GIO58 / HD9							GIO: GIO[58]
							HPI: Data bus bit [9] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D8 / GIO57 / HD8	N15	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Input	Async EMIF: Data Bus bit[08]
EM_D8 / GIO57 / HD8							GIO: GIO[57]
							HPI: Data bus bit [8] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D7 / HD7	L16	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[07]
EM_D7 / HD7							HPI: Data bus bit [7] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D6 / HD6	L18	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[06]
EM_D6 / HD6							HPI: Data bus bit [6] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D5 / HD5	L19	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[05]
EM_D5 / HD5							HPI: Data bus bit [5] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D4 / HD4	L15	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[04]
EM_D4 / HD4							HPI: Data bus bit [4] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D3 / HD3	K15	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[03]
EM_D3 / HD3							HPI: Data bus bit [3] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D2 / HD2	K19	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[02]
EM_D2 / HD2							HPI: Data bus bit [2] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D1 / HD1	K16	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[01]
EM_D1 / HD1							HPI: Data bus bit [1] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_D0 / HD0	K18	I/O/Z	AEMIF / HPI	V_{DD_AEMIF2_18_33}		Input	Async EMIF: Data Bus bit[00]
EM_D0 / HD0							HPI: Data bus bit [0] Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_CE[0] / GIO56 / HCS	M17	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Output	Async EMIF: Lowest numbered Chip Select. Can be programmed to be used for standard asynchronous memories (example:flash), OneNand or NAND memory. Used for the default boot and ROM boot modes.
EM_CE[0] / GIO56 / HCS							GIO: GIO[56]
							HPI: this pin is HPI chip select input. Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_CE[1] / GIO55 / HAS	J17	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF2_18_33}		Output	Async EMIF: Second Chip Select., Can be programmed to be used for standard asynchronous memories (example: flash), OneNand or NAND memory.
EM_CE[1] / GIO55 / HAS							GIO: GIO[55]
							HPI: This pin is host address strobe. Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_WE / GIO54 / HDS2	J15	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF2_18_33}		Output	Async EMIF: Write Enable
							GIO: GIO[54]
							HPI: This pin is host data strobe input 2. Note: HPI is pin multiplexed with Asynchronous EMIF at the output pin. HPI is available only when boot mode selected is HPI boot mode. In this configuration, the device will always act as a slave.
EM_OE / GIO53 / HDS1	J19	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF2_18_33}		Output	Async EMIF: Output Enable
							GIO: GIO[53]
							HPI: This pin is host data strobe input 1.
EM_WAIT / GIO52 / HRDY	J18	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF2_18_33}	IPU	Input	Async EMIF: Async WAIT
							GIO: GIO[52]
							HPI: This pin is host ready output from DSP to host.
EM_ADV / GIO51 / HR/W	M16	I/O/Z	AEMIF / GIO / HPI	V_{DD_AEMIF1_18_33}		Output	Async EMIF: Address Valid Detect for OneNAND interface
EM_ADV / GIO51 / HR/W							GIO: GIO[51]
							HPI: This pin is host read or write select input.
EM_CLK / GIO50	M15	I/O/Z	AEMIF / GIO	V_{DD_AEMIF1_18_33}		Output	Async EMIF: Clock signal for OneNAND flash interface
EM_CLK / GIO50							GIO: GIO[50]
GIO49 / McBSP_DX	D5	I/O/Z	GIO / McBSP	V_DDS33	IPD	Input	GIO: GIO[49]
GIO49 / McBSP_DX							McBSP: Transmit Data
GIO48 / McBSP_CLKX	A5	I/O/Z	GIO / McBSP	V_DDS33	IPD	Input	GIO: GIO[48]
GIO48 / McBSP_CLKX							McBSP: Transmit Clock
GIO47 / McBSP_FSX	C6	I/O/Z	GIO / McBSP	V_DDS33	IPD	Input	GIO: GIO[47]
GIO47 / McBSP_FSX							McBSP: Transmit Frame Sync
GIO46 / McBSP_DR	E6	I/O/Z	GIO / McBSP	V_DDS33	IPD	Input	GIO: GIO[46]
GIO46 / McBSP_DR							McBSP: Receive Data
GIO45 / McBSP_CLKR	B6	I/O/Z	GIO / McBSP	V_DDS33	IPD	Input	GIO: GIO[45]
GIO45 / McBSP_CLKR							McBSP: Receive Clock
GIO44 / McBSP_FSR	E7	I/O/Z	GIO / McBSP	V_DDS33	IPD	Input	GIO: GIO[44]
GIO44 / McBSP_FSR							McBSP: Receive Frame Sync
GIO43 / MMCSD1_CLK / EM_A20	T6	I/O/Z	GIO / MMCSD1 / AEMIF	V_DDS33	IPD	Input	GIO: GIO[43]
GIO43 / MMCSD1_CLK / EM_A20							MMCSD1: Clock
							Async EMIF: Address bit[20]
GIO42 / MMCSD1_CMD / EM_A19	R6	I/O/Z	GIO / MMCSD1 / AEMIF	V_DDS33	IPD	Input	GIO: GIO[42]
GIO42 / MMCSD1_CMD / EM_A19							MMCSD1: Command
							Async EMIF: Address bit[19]
GIO41 / MMCSD1_DATA3 / EM_A18	W5	I/O/Z	GIO / MMCSD / AEMIF	V_DDS33	IPD	Input	GIO: GIO[41]
							MMCSD1: DATA3
							Async EMIF: Address bit[18]
GIO40 / MMCSD1_DATA2 / EM_A17	U5	I/O/Z	GIO / MMCSD1 / AEMIF	V_DDS33	IPD	Input	GIO: GIO[40]
							MMCSD1: DATA2
							Async EMIF: Address bit[17]
GIO39 / MMCSD1_DATA1 / EM_A16	R5	I/O/Z	GIO / MMCSD1 / AEMIF	V_DDS33	IPD	Input	GIO: GIO[39]
							MMCSD1: DATA1
							Async EMIF: Address bit[16]
GIO38 / MMCSD1_DATA0 / EM_A15	V5	I/O/Z	GIO / MMCSD1 / AEMIF	V_DDS33	IPD	Input	GIO: GIO[38]
							MMCSD1: DATA0
							Async EMIF: Address bit[15]
GIO37 / SPI4_SCS[0]/ McBSP_CLKS / CLKOUT0	T5	I/O/Z	GIO / SPI4 / McBSP / CLKOUT	V_DDS33	IPD	Input	GIO: GIO[37]
GIO37 / SPI4_SCS[0]/ McBSP_CLKS / CLKOUT0							SPI4: SPI4 Chip Select 0
							McBSP: CLKS pin to source an external clock
							CLKOUT: Output Clock 0
GIO36 / SPI4_SCLK / EM_A21 / EM_A14	W4	I/O/Z	GIO / SPI4 / AEMIF	V_DDS33	IPD	Input	GIO: GIO[36]
GIO36 / SPI4_SCLK / EM_A21 / EM_A14							SPI4: Clock
							Async EMIF: Address bit[21]
							Async EMIF: Address bit[14]
GIO35 / SPI4_SOMI / SPI4_SCS[1] / CLKOUT1	W3	I/O/Z	GIO / SPI4 /CLKOUT	V_DDS33	IPD	Input	GIO: GIO[35]
GIO35 / SPI4_SOMI / SPI4_SCS[1] / CLKOUT1							SPI4: Slave Out Master In data
							SPI4: SPI4 Chip Select 1
							CLKOUT: Output Clock 1
GIO34 / SPI4_SIMO / SPI4_SOMI / UART1_RXD	V4	I/O/Z	GIO / SPI4 / UART1	V_DDS33	IPD	Input	GIO: GIO[34]
							SPI4: Slave In Master Out data
							SPI4: Slave Out Master In data.
							UART1: RXD
GIO33 / SPI2_SCS[0] / USBDRVVBUS / R1	V3	I/O/Z	GIO / SPI2 / USB /VENC	V_DDS33	IPD	Input	GIO: GIO[33]
GIO33 / SPI2_SCS[0] / USBDRVVBUS / R1							SPI3: SPI3 Chip Select 0
							USB: USB: Digital output to control external 5 V supply
							VENC: Red output data bit 1
GIO32 / SPI2_SCLK / R0	W2	I/O/Z	GIO / SPI2 / VENC	V_DDS33	IPD	Input	GIO: GIO[32]
GIO32 / SPI2_SCLK / R0							SPI2: Clock
							VENC: Red output data bit 0
GIO31 / SPI2_SOMI / SPI2_SCS[1] / CLKOUT2	U4	I/O/Z	GIO / SPI2 / CLKOUT	V_DDS33	IPD	Input	GIO: GIO[31]
GIO31 / SPI2_SOMI / SPI2_SCS[1] / CLKOUT2							SPI2: Slave Out Master In data
							SPI2: SPI2 Chip Select 1
							CLKOUT: Output Clock 2
GIO30 / SPI2_SIMO / G1	T4	I/O/Z	GIO / SPI2 / VENC	V_DDS33	IPD	Input	GIO: GIO[30]
GIO30 / SPI2_SIMO / G1							SPI2: Slave In Master Out data
							VENC: Green output data bit 1
GIO29 / SPI1_SCS[0] / G0	U2	I/O/Z	GIO / SPI1 / VENC	V_DDS33	IPD	Input	GIO: GIO[29]
							SPI1: SPI1 Chip Select 0
							VENC: Green output data bit 0
GIO28 / SPI1_SCLK / B1	V1	I/O/Z	GIO / SPI1 / VENC	V_DDS33	IPD	Input	GIO: GIO[28]
							SPI1: Clock
							VENC: Blue output data bit 1
GIO27 / SPI1_SOMI / SPI1_SCS[1] / B0	T2	I/O/Z	GIO / SPI1 / VENC	V_DDS33	IPD	Input	GIO: GIO[27]
							SPI1: Slave Out Master In data
							SPI1: SPI1 Chip Select 1
							VENC: Blue output data bit 1
GIO26 / SPI1_SIMO	U1	I/O/Z	GIO / SPI1	V_DDS33	IPD	Input	GIO: GIO[26]
							SPI1: Slave In Master Out data
GIO25 / SPI0_SCS[0] / PWM1 / UART1_TXD	T1	I/O/Z	GIO / SPI0 / PWM1 / UART1	V_DDS33	IPD	Input	GIO: GIO[25]
							SPI0: SPI0 Chip Select 0
							PWM1: Output
							UART1: Transmit data
GIO24 / SPI0_SCLK	T3	I/O/Z	GIO / SPI0	V_DDS33	IPD	Input	GIO: GIO[24]
							SPI0: Clock
GIO23 / SPI0_SOMI / SPI0_SCS[1] / PWM0	V2	I/O/Z	GIO / SPI0 / PWM0	V_DDS33	IPD	Input	GIO: GIO[23]
							SPI0: Slave Out Master In data
							SPI0: SPI0 Chip Select 1
							PWM0: Output
GIO22 / SPI0_SIMO	R2	I/O/Z	GIO / SPI0	V_DDS33	IPD	Input	GIO: GIO[22]
							SPI0: Slave In Master Out data
GIO21 / UART1_RTS / I2C_SDA	F3	I/O/Z	GIO / UART1 / I2C	V_DDS33	IPD	Input	GIO: GIO[21]
							UART1: RTS
							I2C: Serial Data
GIO20 / UART1_CTS / I2C_SCL	F1	I/O/Z	GIO / UART1 / I2C	V_DDS33	IPD	Input	GIO: GIO[20]
GIO20 / UART1_CTS / I2C_SCL							UART1: CTS
							I2C: Serial Clock
GIO19 / UART0_RXD	E3	I/O/Z	GIO / UART0	V_DDS33	IPD	Input	GIO: GIO[19]
GIO19 / UART0_RXD							UART0: Receive data
GIO18 / UART0_TXD	E2	I/O/Z	GIO / UART0	V_DDS33	IPD	Input	GIO: GIO[18]
GIO18 / UART0_TXD							UART0: Transmit data
GIO17 / EMAC_TX_EN / UART1_RXD	E4	I/O/Z	GIO / EMAC / UART1	V_DDS33	IPD	Input	GIO: GIO[17]
							EMAC: Transmit enable output
							UART1: Receive Data
GIO16 / EMAC_TX_CLK / UART1_TXD	E1	I/O/Z	GIO / EMAC / UART1	V_DDS33	IPD	Input	GIO: GIO[16]
							EMAC: Transmit clock
							UART1: Transmit Data
GIO15 / EMAC_COL	D2	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[15]
							EMAC: Collision Detect input
GIO14 / EMAC_TXD3	D1	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[14]
							EMAC: Transmit Data 3 output
GIO13 / EMAC_TXD2	D3	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[13]
							EMAC: Transmit Data 2 output
GIO12 / EMAC_TXD1	C1	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[12]
							EMAC: Transmit Data 1 output
GIO11 / EMAC_TXD0	B1	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[11]
							EMAC: Transmit Data 0 output
GIO10 / EMAC_RXD3	B2	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[10]
							EMAC: Receive Data 3 output
GIO9 / EMAC_RXD2	C2	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[09]
							EMAC: Receive Data 2 output
GIO8 / EMAC_RXD1	A2	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[08]
							EMAC: Receive Data 1 output
GIO7 / EMAC_RXD0	A3	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[07]
							EMAC: Receive Data 0 output
GIO6 / EMAC_RX_CLK	B3	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[06]
							EMAC: Receive clock
GIO5 / EMAC_RX_DV	B4	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[05]
							EMAC: Receive data valid input
GIO4 / EMAC_RX_ER	A4	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[04]
							EMAC: Receive error input
GIO3 / EMAC_CRS	C5	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[03]
							EMAC: Carrier sense input
GIO2 / MDIO	C4	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[02]
							EMAC: Management Data I/O
GIO1 / MDCLK	D6	I/O/Z	GIO / EMAC	V_DDS33	IPD	Input	GIO: GIO[01]
							EMAC: Management Data clock output
GIO0	B5	I/O/Z	GIO	V_DDS33	IPD	Input	GIO: GIO[00]
USB_DP	N1	A I/O	USBPHY	V_{DDA33_USB}			USB D+ (differential signal pair) Note: If the USB peripheral is not used at all in the application, this pin should be connected to 3.3V .
USB_DM	P1	A I/O	USBPHY	V_{DDA33_USB}			USB D- (differential signal pair) Note: If the USB peripheral is not used at all in the application, this pin should be connected to V_SS.
V_{DDA33_USB}	P4	PWR					3.3-V USB analog power supply
V_{DDA33_USB}							Note: If the USB peripheral is not used at all in the application, this pin should be connected to 3.3V.
V_{SSA33_USB}	P3	GND					3.3-V USB ground
V_{SSA33_USB}							Note: If the USB peripheral is not used at all in the application, this pin should be connected to V_SS.
V_{DDA12LDO_USB}	M5	PWR				Output	For proper device operation, even if the USB peripheral is not used, a 0.22µF capacitor must be connected as close as possible to the package, and the capacitor mst be connected to V_SSA.
V_{DDA12LDO_USB}
V_{DDA18_USB}	N5	PWR					1.8-V USB analog power supply
V_{DDA18_USB}							Note: If the USB peripheral is not used at all in the application, this pin should be connected to 1.8V.
V_{SSA18_USB}	P2	GND					1.8-V USB ground
V_{SSA18_USB}							Note: If the USB peripheral is not used at all in the application, this pin should be connected to V_SS.
USB_ID	M1	A I	USBPHY	V_{DDA33_USB}			USB operating mode identification pin.
							For device mode operation only, pull up this pin to V_DD with a 1.5K ohm resistor.
							For host mode operation only, pull down this pin to ground (V_SS) with a 1.5K ohm resistor.
							If using an OTG or mini-USB connector, this pin will be set properly via the cable/connector configuration. Note: If the USB peripheral is not used at all in the application, this pin should be connected to 3.3V.
USB_VBUS	N2	A I/O	USBPHY	USB_VBUS			This pin is used by the USB Controller to detect a presence of 5V power (4.4V is the threshold) on the USB_VBUS line for normal operation. This power is sourced by the USB Component that is assuming the role of a Host. In other words, the power on the USB_VBUS line is not sourced by the Device. From DM369 perspective, when operating as a Host, it ensures that the external power supply that the DM369 has sourced is within the required voltage level (>= 4.4V) and when DM369 is operating as a Device, the presence of a 5V power on the VBUS Line is used to signify the presence of an external Host.
							Note 1: When the DM369 is operating as a Device, it uses the power on the USB_VBUS line to power up its internal pullup resistor on the D+ line.
							Note2: If the USB peripheral is not used at all in the application, this pin should be connected to V_SS.
MMCSD0_CLK	J16	O	MMCSD0	V_DDS33		out	MMCSD0: Clock

MMCSD0_CMD	H15	I/O/Z	MMCSD0	V_DDS33		Input	MMCSD0: Command

MMCSD0_DATA3	H16	I/O/Z	MMCSD0	V_DDS33		Input	MMCSD0: DATA3

MMCSD0_DATA2	H17	I/O/Z	MMCSD0	V_DDS33		Input	MMCSD0: DATA2

MMCSD0_DATA1	H19	I/O/Z	MMCSD0	V_DDS33		Input	MMCSD0: DATA1

MMCSD0_DATA0	H18	I/O/Z	MMCSD0	V_DDS33		Input	MMCSD0: DATA0

MICIP	B8	AI	VCODEC	V_{DDA33_VC} or V_{DDA18_VC}			MIC positive input Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
MICIN	C8	AI	VCODEC	V_{DDA33_VC} or V_{DDA18_VC}			MIC negative input Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
LINEO	C9	AO	VCODEC	V_{DDA33_VC} or V_{DDA18_VC}			Line driver output Note: If the Voice Codec peripheral is not used, this pin can be left open or can be connected directly to V_ss for proper device operation.
SPP	B9	AO	VCODEC	V_{DDA33_VC} or V_{DDA18_VC}			Speaker amplifier positive output Note: If the Voice Codec peripheral is not used, this pin can be left open or can be connected directly to V_ss for proper device operation.
SPN	A9	AO	VCODEC	V_{DDA33_VC} or V_{DDA18_VC}			Speaker amplifier negative output Note: If the Voice Codec peripheral is not used, this pin can be left open or can be connected directly to V_ss for proper device operation.
VCOM	A8	AO	VCODEC	V_{DDA33_VC} or V_{DDA18_VC}			Analog block common voltage. It is recommended that a 10µF capacitor be connected between this pin and ground to provide clean voltage. Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{DDA18_VC}	E9	PWR					1.8-V Voice Codec module analog power supply Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{SSA18_VC}	F9	GND					1.8-V Voice Codec module ground Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{DDA33_VC}	E10	PWR					3.3-V Voice Codec module power supply Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
V_{SSA33_VC}	D9	GND					3.3-V Voice Codec module ground Note: If the Voice Codec peripheral is not used, this pin must be tied directly to V_SS for proper device operation.
ADC_CH0	E8	AI	ADC	V_{DDA18_ADC}			Analog-to-Digital converter channel 0 Note: If the ADC is not used, it is recommended to either leave this pin open, as no connect, or tie this pin along with the other ADC_CHs together to a single resistor to ground.
ADC_CH1	B7	AI	ADC	V_{DDA18_ADC}			Analog-to-Digital converter channel 1 Note: If the ADC is not used, it is recommended to either leave this pin open, as no connect, or tie this pin along with the other ADC_CHs together to a single resistor to ground.
ADC_CH2	A7	AI	ADC	V_{DDA18_ADC}			Analog-to-Digital converter channel Note: If the ADC is not used, it is recommended to either leave this pin open, as no connect, or tie this pin along with the other ADC_CHs together to a single resistor to ground.
ADC_CH3	D8	AI	ADC	V_{DDA18_ADC}			Analog-to-Digital converter channel 3 Note: If the ADC is not used, it is recommended to either leave this pin open, as no connect, or tie this pin along with the other ADC_CHs together to a single resistor to ground.
ADC_CH4	D7	AI	ADC	V_{DDA18_ADC}			Analog-to-Digital converter channel 4 Note: If the ADC is not used, it is recommended to either leave this pin open, as no connect, or tie this pin along with the other ADC_CHs together to a single resistor to ground.
ADC_CH5	A6	AI	ADC	V_{DDA18_ADC}			Analog-to-Digital converter channel 5 Note: If the ADC is not used, it is recommended to either leave this pin open, as no connect, or tie this pin along with the other ADC_CHs together to a single resistor to ground.
V_{DDA18_ADC}	G9	PWR					1.8- V Analog-to-Digital converter analog power supply Note: If the ADC is not used at all in an application, this pin can be directly connected to the 1.8-V supply without any filtering or to ground.
V_{SSA_ADC}	F8	GND					1.8- V Analog-to-Digital converter ground
PWCTRIO0	J3	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 0 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRIO1	J2	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 1 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRIO2	J1	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 2 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRIO3	J5	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 3 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRIO4	J4	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 4 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRIO5	K5	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 5 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRIO6	K4	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Input	PRTCSS: General Input / Output Signal 6 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRO0	K2	O	PRTCSS	V_{DD18_PRTCSS}		Output	PRTCSS: General Output Signal 0 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRO1	L5	O	PRTCSS	V_{DD18_PRTCSS}		Output	PRTCSS: General Output Signal 1 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRO2	L4	I/O/Z	PRTCSS	V_{DD18_PRTCSS}		Output	PRTCSS: General Output Signal 2 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWCTRO3	L3	O	PRTCSS	V_{DD18_PRTCSS}		Output	PRTCSS: General Output Signal 3 For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
RTCXI	G1	I	PRTCSS	V_{DD12_PRTCSS}		Input	PRTCSS: Crystal Input for PRTCSS oscillator Note: If the RTC calendar is not used, this pin should be pulled down. For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
RTCXO	H1	O	PRTCSS	V_{DD12_PRTCSS}		Output	PRTCSS: Crystal Output for PRTCSS oscillator Note: If the RTC calendar is not used, this pin should be left unconnected. For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWRST	M3	I	PRTCSS	V_{DD12_PRTCSS}		Input	PRTCSS: Reset signal for PRTCSS For more pin termination details, see Section 7.7, Power Management and Real Time Clock Subsystem (PRTCSS).
PWRCNTON	M2	I	PRTCSS	V_{DD12_PRTCSS}		Input	PRTCSS: Reset pin for system power sequencing For more pin details, see Section 7.7.
RESET	H3	I		V_DDS33		Input	Global chip reset
MXI1	L1	I	CLOCKS	V_DDMXI		Input	Crystal input for system oscillator Note: If an external oscillator is to be used, the external oscillator clock signal should be connected to the MXI1 pin with a 1.8V amplitude. The MXO1 should be left unconnected and the VSS_MX1 signal should be connected to board ground (V_ss).
MXO1	K1	O	CLOCKS	V_DDMXI		Output	Output for system oscillator Note: If an external oscillator is to be used, the external oscillator clock signal should be connected to the MXI1 pin with a 1.8V amplitude. The MXO1 should be left unconnected and the VSS_MX1 signal should be connected to board ground (V_ss).
TCK	F4	I	EMULATION	V_DDS33	IPU	Input	JTAG test clock input
TDI	F5	I	EMULATION	V_DDS33	IPU	Input	JTAG test data input
TDO	G4	O	EMULATION	V_DDS33		Output	JTAG test data output
TMS	G2	I	EMULATION	V_DDS33	IPU	Input	JTAG test mode select
TRST	H5	I	EMULATION	V_DDS33	IPD	Input	JTAG test logic reset
RTCK	F2	O	EMULATION	V_DDS33		Output	JTAG test clock output
EMU0	G5	I/O	EMULATION	V_DDS33	IPU	Input	JTAG emulation 0 I/O


EMU1	H4	I/O	EMULATION	V_DDS33	IPU	Input	JTAG emulation 1 I/O
							EMU[1:0] = 00 - Force Debug Scan chain (ARM and ARM ETB TAPs connected)
							EMU[1:0] = 11 - Normal Scan chain (ICEpick only)
RSV2	R4	I					For proper device operation, this pin must be tied to ground.
RSV1	R1	O					For proper device operation, this pin must be left unconnected.
RSV0	A1	O					For proper device operation, this pin must be left unconnected.
CV_DD	G6	PWR					Core power (1.35-V).
	G8
	H7
	H8
	H12
	J8
	J12
	J14
	K8
	K12
	L13
	M6
	M10
	M12
	M13
V_{DD12_PRTCSS}	J6	PWR					Power supply for RTC oscillator, PRTCSS, and PRTCSS I/O (1.35-V).
V_{DD12_PRTCSS}	K7	PWR
V_{DDA18_PLL}	N4	PWR					Analog power for PLL (1.8 V).
V_DDRAM	D4	O				Output	For proper device operation, this pin must be connected to a 1.0uF (6.2V) capacitor, and the other end of the capacitor must be connected to V_ss. Note: this pin is an internal power supply pin and should not be connected to any external power supply.”
V_DDS18	G14	PWR					Power supply for 1.8-V I/O.
	H11
	H14
	J7
	M14
	P7
V_{DD18_PRTCSS}	K6	PWR					Power supply for PRTCSS (1.8 V).
V_DDMXI	L6	PWR					Power supply for PLL oscillator (1.8 V).
V_{DD18_SLDO}	E5	PWR					Power supply for internal RAM. For proper device operation, this pin must always be connected to V_DDS18.
V_{DD18_DDR}	N9	PWR					Power supply for DDR (1.8 V).
	N11
	P9
	P10
	P12
	R12
V_DDS33	F10	PWR					Power supply for 3.3-V I/O.
	F6
	F7
	H6
	H13
	L12
	N6
	P5
	P6
V_{DD_AEMIF1_18_33}	P14	PWR					Power supply for switchable AEMIF (3.3/1.8 V). V_{DD_AEMIF1_18_33} : can be used as a power supply for EM_A[3:13], EM_BA0, EM_BA1, EM_CE[0], EM_ADV, EM_CLK, EM_D[8:15] or as GPIO pins. See AEMIF pin descriptions. V_{DD_AEMIF2_18_33:}can be used as a power supply for EM_A[0:2], EM_CE[1], EM_WE, EM_OE, EM_WAIT, EM_D[0:7] pins, HPI, or GPIO pins. See AEMIF pin descriptions. Example 1: V_{DD_AEMIF2_18_33} at 1.8-V for 8-bit NAND V_{DD_AEMIF1_18_33} at 3.3-V for GPIO. Example 2: V_{DD_AEMIF1_18_33} and V_{DD_AEMIF2_18_33} at 1.8-V for 16-bit NAND.
V_{DD_AEMIF1_18_33}	R14	PWR
V_{DD_AEMIF2_18_33}	K14	PWR
V_{DD_AEMIF2_18_33}	L14	PWR
V_{DD_ISIF18_33}	F12	PWR					Power supply for switchable ISIF (3.3/1.8 V). Example 1 V_{DD_ISIF_18_33} power supply can be at 1.8V for VPFE pin functionality or it can be at 3.3V if other peripherals pin functionality is to be used like SPI3 or GPIO or CLKOUT0, or USBDRVVBUS.
V_{DD_ISIF18_33}	F13	PWR
V_PP	R3	PWR					For proper device operation, this pin must always be connected to CV_DD.
V_SS	A19	GND					Digital ground
	E14
	F14
	G11
	G12
	H9
	H10
	J9
	J10
	J11
	J13
	K9
	K10
	K11
	L7
	L8
	L9
	L10
	L11
	M7
	M8
	M9
	M11
	N8
	N12
	N14
	P8
	P13
	W1
	W19
V_{SS_MX1}	L2	GND					System oscillator - ground Note: If an external oscillator is used, this pin must be connected to board ground (V_ss).
V_{SS_32K}	H2	GND					PRTCSS oscillator - ground
V_SSA	M4	GND					Analog ground

(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.

(2) Specifies the operating I/O supply voltage for each signal. See Section 7.3 , Power Supplies for more detail.

(3) PD = pulldown, PU = pullup. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.)

(4) To reduce EMI and reflections, depending on the trace length, approximately 22 Ω to 50 Ω damping resistors are recommend on the following outputs placed near the device: YOUT(0-7),COUT(0-7), HSYNC,VSYNC,LCD_OE,FIELD, and,VCLK. The trace lengths should be minimized.

(5) The Y input (YIN[7:0]) and C input (CIN[7:0]) buses can be swapped by programming the field bit YCINSWP in the VPFE CCD Configuration (CCDCFG) register (0x01C7 0136h).
IF YCINSWP bit is 0 (default) YIN[7:0] = Y signal / CIN[7:0] = C signal .
IF YCINSWP bit is 1 YIN[7:0] = C signal / CIN[7:0] = Y signal
For more information, see the TMS320DM36x Video Processing Front End (VPFE) User's Guide (SPRUFG8).

(6) The Y output (YOUT[7:0]) and C output (COUT[7:0]) buses can be swapped by programming the field bit YCOUTSWP in the VPFE CCD Configuration (CCDCFG) register (0x01C7 0136h). If the YCOUTSWP bit is 0 (default), YOUT[7:0] = Y signal / COUT[7:0] = C signal . If the YCOUTSWP bit is 1, YOUT[7:0] = C signal / COUT[7:0] = Y signal. For more information, see the TMS320DM36x Video Processing Front End (VPFE) User's Guide (SPRUFG8).