SCBS881E January   2010  – October 2018 TMS3705

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics for D (SOIC) Package
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
  6. 6Detailed Description
    1. 6.1  Power Supply
    2. 6.2  Oscillator
    3. 6.3  Predrivers
    4. 6.4  Full Bridge
    5. 6.5  RF Amplifier
    6. 6.6  Band-Pass Filter and Limiter
    7. 6.7  Diagnosis
    8. 6.8  Power-on Reset
    9. 6.9  Frequency Divider
    10. 6.10 Digital Demodulator
    11. 6.11 Transponder Resonance-Frequency Measurement
    12. 6.12 SCI Encoder
    13. 6.13 Control Logic
    14. 6.14 Test Pins
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Diagram
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Community Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of devices. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TMS3705).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

X and P devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, D). Figure 8-1 provides a legend for reading the complete device name.

For orderable part numbers of TMS3705 devices in the D package types, see the Package Option Addendum in Section 9, the TI website, or contact your TI sales representative.

TMS3705 dev_nomen_SCBS881.gifFigure 8-1 Device Nomenclature