SCDS389C August   2018  – December 2018 TMUX1208 , TMUX1209

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Example
      2.      TMUX1208, TMUX1209 Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions TMUX1208
    2.     Pin Functions TMUX1209
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics (VDD = 5 V ±10 %)
    6. 7.6 Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 7.7 Electrical Characteristics (VDD = 1.8 V ±10 %)
    8. 7.8 Electrical Characteristics (VDD = 1.2 V ±10 %)
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  On-Resistance
      2. 8.1.2  Off-Leakage Current
      3. 8.1.3  On-Leakage Current
      4. 8.1.4  Transition Time
      5. 8.1.5  Break-Before-Make
      6. 8.1.6  tON(EN) and tOFF(EN)
      7. 8.1.7  Charge Injection
      8. 8.1.8  Off Isolation
      9. 8.1.9  Crosstalk
      10. 8.1.10 Bandwidth
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail to Rail Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Fail-Safe Logic
      5. 8.3.5 Device Functional Modes
      6. 8.3.6 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Information
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TMUX1208 and TMUX1209 are general purpose complementary metal-oxide semiconductor (CMOS) multiplexers (MUX). The TMUX1208 offers 8:1 single-ended channels, while the TMUX1209 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from personal electronics to building automation applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TMUX1208
TMUX1209		 TSSOP (16) 5.00 mm × 4.40 mm
QFN (16) 2.60 mm x 1.80 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.

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