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Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 0.75 Bandwidth (MHz) 125 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Supports I2C signals Input/output continuous current (Max) (mA) 30 Rating Catalog CON (Typ) (pF) 42 Supply current (Typ) (uA) 0.02 open-in-new Find other Analog switches & muxes

Package | Pins | Size

TSSOP (PW) 16 22 mm² 5 x 4.4 UQFN (RSV) 16 5 mm² 2.6 x 1.8 open-in-new Find other Analog switches & muxes

Features

  • Rail to Rail Operation
  • Bidirectional Signal Path
  • Low On-Resistance: 5 Ω
  • Wide Supply Range: 1.08 V to 5.5 V
  • -40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Fail-Safe Logic
  • Low Supply Current: 10 nA
  • Transition Time: 14 ns
  • Break-Before-Make Switching
  • ESD Protection HBM: 2000 V
  • Industry-Standard TSSOP and QFN Packages

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Description

The TMUX1208 and TMUX1209 are general purpose complementary metal-oxide semiconductor (CMOS) multiplexers (MUX). The TMUX1208 offers 8:1 single-ended channels, while the TMUX1209 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from personal electronics to building automation applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

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Exact equivalent in functionality and parametrics to the compared device:
TMUX1109 ACTIVE 3-pA, 5-V, ±2.5-V, 4:1, 2-channel precision multiplexer Upgraded on-state leakage (<1nA)

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet TMUX1208 5-V Bidirectional 8:1, 1-Channel Multiplexer TMUX1209 5-V Bidirectional 4:1, 2-Channel Multiplexer datasheet (Rev. C) Dec. 13, 2018
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM208.ZIP (9 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
TSSOP (PW) 16 View options
UQFN (RSV) 16 View options

Ordering & quality

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