SCDS391C October   2018  – December 2019 TMUX1574

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Example
      2.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
      1. 6.8.1 Eye Diagrams
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Low Capacitance
      7. 8.3.7 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

PW Package
16-Pin TSSOP
Top View
DYY Package
16-Pin SOT-23-THIN
Top View
RSV Package
16-Pin UQFN
Top View

Pin Functions

PIN TYPE(1) DESCRIPTION(2)
NAME TSSOP /
SOT-23-THIN		 UQFN
SEL 1 15 I Select pin: controls state of switches according to Table 1. Internal 6 MΩ pull-down to GND.
S1A 2 16 I/O Source pin 1A. Can be an input or output.
S1B 3 1 I/O Source pin 1B. Can be an input or output.
D1 4 2 I/O Drain pin 1. Can be an input or output.
S2A 5 3 I/O Source pin 2A. Can be an input or output.
S2B 6 4 I/O Source pin 2B. Can be an input or output.
D2 7 5 I/O Drain pin 2. Can be an input or output.
GND 8 6 P Ground (0 V) reference
D3 9 7 I/O Drain pin 3. Can be an input or output.
S3B 10 8 I/O Source pin 3B. Can be an input or output.
S3A 11 9 I/O Source pin 3A. Can be an input or output.
D4 12 10 I/O Drain pin 4. Can be an input or output.
S4B 13 11 I/O Source pin 4B. Can be an input or output.
S4A 14 12 I/O Source pin 4A. Can be an input or output.
EN 15 13 I Active low enable: When this pin is high, all switches are turned off. When this pin is low, SEL pin controls the signal path selection. Internal 6 MΩ pull-down to GND.
VDD 16 14 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
(1) I = input, O = output, I/O = input and output, P = power
(2) Refer to Device Functional Modes for what to do with unused pins.