The TMUX1574 is a complementary metal-oxide semiconductor (CMOS) switch. The TMUX1574 offers 2:1 SPDT switch configuration with 4-channels. Wide operating supply of 1.5 V to 5.5 V allows for use in a broad array of applications from servers and communication equipment to industrial applications. The device supports bidirectional analog and digital signals on the source (SxA, SxB) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input/output voltage of 5.5 V.
Powered-off Protection up to 3.6 V on the signal path of the TMUX1574 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.
Fail-Safe Logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. All control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Integrated pull down resistor on the logic pins removes external components to reduce system size and cost.
For additional terms or required resources, click any title below to view the detail page where available.
The AM2x BLDC Servo Motor BoosterPack plug-in module is an add-on for the AM2x LaunchPad development kits. This BoosterPack provides up to two axes of 24V/8A BLDC driver, ADC/SDFM current feedback, industrial absolute encoder, and resolver feedback.
The TMAG5110-5111EVM is a rotary encoding board with dual Hall latches that have separate circuitry for both quadrature (TMAG5110) and speed and direction (TMAG5111) implementations. There are two different magnets and two magnet placement options to highlight the dual-latch capability of pole (...)
The TMUXBQB-DYYEVM allows for the quick prototyping and DC characterization of our line of TMUX products that use the 16-pin TSSOP (PW), WQFN (BQB) and SOT-23 THIN (DYY) packages.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Use our reference design selection tool to review and identify designs that best match your application and parameters.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| UQFN (RSV) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
| SOT-23-THN (DYY) | 16 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.